Career Opportunity: Director Materials/IEC Engagement

IPC — Association Connecting Electronics Industries is looking to hire a Director Materials/IEC (International Electrotechnical Commission) Engagement. 

The Director Materials/IEC Engagement is a strategic role that is responsible for directing the printed board materials standards activities at IPC focusing on best practices and industry needs to ensure value for the industry.

Reporting to the Sr. Director, Assembly & Standards Technology, the Director Materials/IEC Engagement also works closely with internal and external stakeholders to ensure the appropriate objectives and priorities are enabled and achieved within the organization.


  • Direct and lead standard development projects that promote best practices for printed board materials, including:  processes, fabrication, equipment and related services. Track status, provide input on translations and identify new projects, including data on industry need, for consideration utilizing online technical committee resource tools (IPC Works) and project management tools (Smartsheet) for printed board materials projects
  • Engage in IEC activities, notably TAG 91, to ensure industry value.
  • Provide technical support and communication to IPC Members and IPC Staff regarding interpretation of standards and applications of technology and participate in development of related materials to supplement standards such as trade magazine articles regarding standards and techology and webpages.
  • Collaborate with suppliers in the development of software tools and round robin testing used in conjunction with standards.
  • Making recommendations on new and continuing projects on topics related to materials standards.
  • Identifying opportunities for IPC involvement in industry-related projects.
  • Tracking activities and ensuring coverage of key projects
  • Managing committee activities in accordance with IPC Standardization Procedures, including committee chairmen and committee activities, publication of minutes, development of working drafts, balloting of standards, comment resolution, editing proof reading, file preparation for translation activities, and oversight of publication of specifications and guidelines and other technical documents related to the qualification/acceptability of printed board and assembly materials.


  • Bachelor’s degree in Technical Field required
  • Minimum of 5 years electronics printed board fabrication or assembly related field.
  • 5 years of project management related experience preferred.
  • Exceptional communication, organizational and presentation skills
  • Willingness to travel and independently support member meetings, at least 20% of the time, including locally, domestically and internationally.
  • Computer proficiency including Microsoft Office: Word, Excel, PowerPoint and Outlook.  Experience with NetSuite a plus.

IPC practices a virtual workspace and maintains offices in Chicago and Atlanta.

IPC—Association Connecting Electronics Industries is an Equal Opportunity Employer offering a competitive salary and very generous employee benefits

MRA – The Management Association is conducting this search on behalf of IPC—Association Connecting Electronics Industries. Please send resume, cover letter and salary history to e-mail: Lyssa.bernstein@mranet.orgResumes should include cover letter and salary history and subject line should say: MATERIALS

Since 1957, IPC — Association Connecting Electronics Industries® has been guiding the electronics industry through its dramatic changes. A global trade association dedicated to the competitive excellence and financial success of its more than 4,200 member companies, IPC represents all facets of the industry including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.2 trillion global electronics industry. IPC maintains offices in Bannockburn, IL; Taos, N.M.; Washington, D.C,; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.