IPC International Technology Roadmap
for Electronic Interconnections 2011
Order the IPC Technology Roadmap and put its informational resources to work for your long-range and strategic planning activities. It’s like adding your own global research department to your staff … for only $75/$150.
Over the next several years, the electronic interconnect industry will experience numerous technological changes. Some of these advancements will be small and hardly noticeable; others may genuinely transform the industry. For any company in the electronics supply chain, having an understanding of these changes can mean the difference between success and failure.
Published every two years, IPC International Technology Roadmap for Electronic Interconnections has been a leading resource for identifying future technological changes. Its development is the direct result of an extensive two-year study into the future technology landscape of the industry, aggregating rich informational resources from all areas of the supply chain and all corners of the world, with input from industry leaders and insight from the “brightest drivers of the field.” While the IPC Roadmap is produced in concert with other industry organizations’ roadmapping efforts, it focuses exclusively on the printed board and electronics assembly industries and centers on the manufacturing of substrates and assemblies.
What the IPC Roadmap can do for you:
- Gain insight into future technological advances and how the printed board and EMS industries will cope with expected changes in board, component and assembly technology from 2012 to 2020.
- Get details of how these changes may impact virtually every operation on the manufacturing floor.
- Enable your company to test its short- and long-term goals within a future technology landscape to help navigate the success of those goals.
- Understand how anticipated changes in packaging, nanotechnology and optoelectronics technologies will impact you.
- Learn how global material elimination directives affect material declaration, recycling and regulatory education.
- See how the technology trends identified provide new methods for the integration of electronics into semiconductor packages and focus on electrical performance and miniaturization.
- Compare aspects of your company’s products to the technology drivers of tomorrow using an exclusive software analysis program developed by the National Institute of Standards and Technology (NIST).
- Get a sneak peek into new unique interconnections and assembly potential through dedicated chapters that introduce revolutionary applications still in the embryonic stage.
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Guidance from Product Emulators
The foundation of the IPC Roadmap is its “product emulators” — used to depict OEM needs. Emulators reflect a specific product type as represented by a specific board assembly or piece of equipment. Created with valuable input from several OEMs and experts, the emulators embrace more than one technology philosophy and provide important information for future process and equipment development. Product emulators selected for emphasis in the 2011 IPC Roadmap release are:
- Interposer — Consumer Product (1a)
- Portable Board — Consumer Product (1c)
- Portable Board — Computer and Peripherals (2c)
- Interposer — Telecom (3a)
- Module — Telecom (3b)
- Product Board — Telecom (3d)
- Backplane — Telecom (3e)
- Module — Industrial and Automotive (Passenger Compartment) (5b)
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- Product Board — Module-Industrial and Automotive (Passenger Compartment) (5d)
- Module— Military-Application (6b)
- Product Board — Space Application (7d)
- Backplane — Military Aircraft (8e)
- Product Board — Automotive (under hood) (9d)
- Portable Board — Biomedical and Life Support (10c)
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View the Table of Contents
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