IPC Liste für Industriekürzel

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AA

Antenna Array

AA

Automatic Acknowledge

ABS

Acrylonitrile-Butadiene-Styrene(Plastic)

AC

All Call

AC

Alternating Current

ACA

Anisotropically Conductive Adhesive

ACC

Advanced Concept Construction Active Control Channel

ACCU

Alternating Current Connection Unit

AEC

Architecture, Engineering And Construction

Agc

Automatic Gain Control

AGR

Annual Average Growth Rate

AGV

Automated Guided Vehicle

AI

Artificial Intelligence

AIS

Adhesive Interconnect System

ANOVA

Analysis Of Variance

ANSI

American National Standards Institute

AOI

Automated Optical Inspection

AOQ

Average Outgoing Quality

APT

Automatically Programmed Tools

AQL

Acceptable Quality Level

ARINC

Aeronautical Radio Incorporated

ASCII

American Standard Code For Information Interchange

ASIC

Application Specific Integrated Circuit

ASME

American Society Of Mechanical Engineers

ASPaRC

Ability Of Solder Paste To Retain Components

ASQ

American Society For Quality

ASTM

American Society For Testing And Materials

ATE

Automatic Test Equipment

ATG

Automatic Test Generation

ATR

Air Transport Rack

AVT

Accelerated Vesication Test

AWG

American Wire Gauge

AXI

Automated X-Ray Inspection

BC

Buried Capacitance

BDMA

Benzyldimethylamine

BGA

Ball Grid Array

BITE

Built-In Test Equipment

BOD

Biochemical Oxygen Demand

BOM

Bill Of Material

BOT

Build To Order

BT

Bismaleimide Triazine

BTAB

Bumped Tape-Automated Bonding

C&E

Cause And Effect

C3

Command,Control And Communicate

C4

Controlled Collapse Component Connection

CAD

Computer-Aided Design

CAE

Computer-Aided Engineering

CAF

Cathotic Anionic Filaments

CAFM

Computer-Aided Facilities Management

CAGE

Commercial And Government Entity

CALS

Computer-Aided Acquisition And Logistic Support(DOD)

CAM

Computer-Aided Manufacturing

CAPP

Computer-Aided Process Planning

CAR

Computer-Aided Repair

CASE

Computer-Aided Software Engineering

CAT

Computer-Aided Testing

CBGA

Ceramic Ball Grid Array

CCAPS

Circuit Card Assembly And Processing System

CDA

Copper Development Association

CEPM

Certified Ems Program Managers

CET

Certified Electronic Technician

CFM

Continuous Flow Manufacturing

CFM

Cubic Feet Per Minute

CIM

Computer-Integrated Manufacturing

CISC

Complex Instruction Set Computing

CITIS

Contractor Integrated Technical Information Services

CM

Contract Manufacturer

CMC

Copper Moly Copper

CMOS

Complimentary Metal-Oxide Semiconductor

CNC

Computer Numerical Control

COB

Chip-On-Board

COD

Consumed Oxygen Demand

COT

Configure To Order

Cp

Capability Performance

CPL

Capability Performance, Lower

CPLD

Complex Programmable Logic Device

CPU

Capability Performance, Upper

CPU

Central Processing Unit(Computer)

CRC

Cyclic Redundancy Check

CRT

Cathode-Ray Tube

CSA

Canadian Standards Agency

CSG

Constructive Solids Geometry

CSP

Chip Scale Package

CTE

Coefficient Of Thermal Expansion

CVS

Cyclic Voltammetry Stripping

DAB

Designated Audit Body

DATC

Design Automation Technical Committee (Ieee)

DBMS

Database Management System

DC

Direct Current

DCAS

Defense Contract Administration Service

DCMA

Defense Contract Management Agency

DCMC

Defense Contract Management Command

DESC

Defense Electronics Supply Center

DFM

Design For Manufacture

DIM

Data-Information Record

DIN

Deutsches Institute For Normung

DIP

Dual-Inline Package

Dk

Dielectric Constant

DLA

Defense Logistics Agency (Dod)

DMA

Direct Memory Access

DMS

Dynamic Mechanical Spectroscopy

DMSA

Defense Manufacturers And Suppliers Association

DNC

Distributed (Or Direct) Numerical Control

DOD

Department Of Defense

DOD

Dissolved Oxygen Demand

DOE

Design Of Experiments

DOS

Disc Operating System

DRC

Design Rule Checking

DRM

Drawing Requirements Manual

DS

Double-Sided

DSC

Differential Scanning Calorimetry

DSP

Digital Signal Processor

DTP

Diameter True Position

DTS

Dock To Stock

DVM

Digital Voltmeter

DXF

Data Exchange Format

ECAD

Electronic Computer-Aided Design

ECC

Error Correction Code

ECCB

Electronic Components Certification Board

ECL

Emitter-Coupled Logic

ECM

Electronic Countermeasures

ECN

Engineering Change Notice

ECO

Engineering Change Order

ECR

Engineering Change Request

ED

Electrodeposited

EDA

Electronic Design Automation

EDI

Electronic Data Interchange

EDIF

Electronic Design Interchange Format

EDM

Electro-Discharge Machining

EDO

Extended Data Out

EIA

Electronics Industry Association

EIS

Engineering Information System

ELD

Electro-Luminescent Diode

EMC

Electromagnetic Compatibility

EMF

Electro-Motive Force

EMI

Electromagnetic Interference

EMP

Electromagnetic Pulse

EMPF

Electronics Manufacturing Productivity Facility

EMS

Electrical Manufacturing Services

EPA

Environmental Protection Agency

EPR

Ethylene-Propylene (Copolymer) Resin

EPT

Ethylene-Propylene Terepolymer

ESD

Electrostatic Discharge

ESI

Early Supplier Involvement

ESR

Equivalent Series Resistance

ETPC

Electrolytic Tough-Pitch Copper

FAA

Federal Aviation Administration

FAR

Failure Analysis Report

FCC

Federal Communications Commission

FCC

Flat-Conductor Cable

FC-CBGA

Flip Chip Ceramic Ball Grid Array

FC-PBGA

Flip Chip Platic Ball Grid Array

FCT

Functional Circuit Test

FEA

Finite-Element Analysis

FEM

Finite-Element Modeling

FEP

Fluorinated Ethylene-Propylene (Teflon)

FET

Field-Effect Transistor

FFT

Fast Fourier Transform

FMEA

Fault Mode And Effect Analysis

FPGA

Field Programmable Gate Array

FPT

Fine-Pitch Technology

FSCM

Federal Stock Code For Manufacturers

FTP

File Transfer Protocol

GaAs

Gallium Arsenide

GBIB

General Purpose Interface Bus

GMA

Gas Metal Arc (Welding)

GTA

Gas Tungsten Arc (Welding)

GTPBGA

Glob Top Plastic Ball Grid Array

HASL

Hot Air Solder Level

HPGL

Hewlett Packard Graphic Language

THE

High Temperature Elongation

HTML

Hypertext Markup Language

HTTP

Hypertext Transfer Protocol

I/O

Input/Output (Terminations)

IC

Integrated Circuit

ICA

Isotropically Conductive Adhesive

ICAM

Integrated Computer-Aided Manufacturing

ICT

Inner Circuit Test

IDC

Insulation-Displacement Connection

IEC

International Electrotechnical Commission

IECQ

International Electronic Component Qualification System

IEDR

Initial Engineering Design Review

IEEE

Institute Of Electrical And Electronic Engineers

IEPS

International Electronic Packaging Society

IGES

Integrated Graphics Exchange System

ILB

Inner-Lead Bonding (Tab)

IP

Internet Protocol

IPM

Inches Per Minute

IR

Infrared

ISCET

International Society Of Certified Electronics Technician

ISHM

International Society For Hybrid Microelectronics

ISO

International Organization For Standardization

ITT

Inter-Test Time

JEDEC

Solid State Technology Association (Formerly The Joint Electronic Device Engineering Council)

JIT

Just-In-Time (Manufacturing)

KGB

Known Good Board

KGD

Known Good Die

LAN

Local Area Network

LBA

Logical Block Address

LCCC

Leadless Ceramic Chip Carrier

LCD

Liquid Crystal Display

LDA

Logic Design Automation

LED

Light-Emitting Diode

LGA

Lang Grid Array

LIF

Low Insertion Force

LMC

Least Material Condition

LPISM

Liquid Photo-Imageable Solder Mask

LRU

Lowest Replaceable Unit

LSI

Large Scale Integration (Integrated Circuit)

LTCC

Low Temperature Co-Fired Ceramic

MA

Mechanical Advantage

MAC

Maximum Allowable Concentration

MAC

Media Access Control

MAP

Manufacturing Automation Protocol

MATS

Material Transport Segment

MCAD

Mechanical Computer Aided Design

MCAE

Mechanical Computer-Aided Engineering

MCM

Multichip Module

MDA

Methylenedianiline

MEK

Methyl-Ethyl Ketone

MELF

Metal Electrode Face (Discrete Leadless Component)

MIBK

Methyl-Isobutyl Ketone

MIR

Moisture Insulation Resistance

MITI

Ministry Of International Trade And Industry (Japan)

MLB

Multilayer Board

MLPWB

Multilayer Printed Wiring Board

MMC

Maximum Material Condition

MMIC

Monolithic Microwave Integrated Circuit

MOS

Metal-Oxide Semiconductor

MRP

Material Requirement Planning

MRP II

Manufacturing Resource Planning

MSDS

Material Safety Data Sheets

MSI

Medium Scale Integration (Integrated Circuit)

MTBF

Mean Time Between Failures

MTTR

Mean Time To Repair

NADCAP

National Aerospace And Defense Contractors Accreditation Procedures

NASA

National Aeronautics And Space Administration

NBR

Nitrile Butadiene-Acrylonitrile Rubber

NBS

National Bureau Of Standards

NC

Numerical Control

NDT

Non-Destructive Testing

NECQ

National Electronics Component Qualification System

NEMA

National Electrtical Manufacturers Association

NIST

National Institute For Science And Technology

NMR

Normal-Mode Rejection

NPI

New Product Introduction

NSA

National Security Agency

OA

Organic Acid (Flux)

ODR

Oscillating Disk Rheometer

OEM

Original Equipment Manufacturer

OFHC

Oxygen-Free High-Conductivity Copper

OLB

Outer-Lead Bonding (Tab)

OSHA

Occupational Safety Hazards Act

OSI

Open Systems Interconnection

OSP

Organic Solder Preservative

P&IA

Packaging And Interconnecting Assembly

P&IS

Packaging And Interconnecting Structure

PBGA

Plastic Ball Grid Array

PB

Printed Board

PBX

Private Branch Exchange

PC

Personal Computer

PCA

Printed Circuit Assembly

PCB

Printed Circuit Board

PCMCIA

Personal Computer Memory Card International Assoc

PDES

Product Data Exchange Specification

PDL

Page Description Language

PEM

Plastic Electronic Module

PGA

Pin Grid Array (Leaded Component Package)

PHIGS

Programmer's Hierarchical Interface Graphics Standard

PID

Photo-Imageable Dielectric

PIP

Pin-In-Paste Technology

PLCC

Plastic Leaded Chip Carrier

PLD

Programmable Logic Device

Pp

Process Performance (See Also Cp)

PPM

Parts Per Million

PPO

Polyphenylene Oxide

PPS

Polyphenylene Sulfide (Plastic)

PRT

Planar Resistor Technology

PSI

Pounds Per Square Inch