IPC has renewed its commitment to serving the industry by expanding the scope and scale of research under a newly created IPC Industry Intelligence (i3) program.
LATEST REPORTS:
Advanced Packaging to Board Level Integration -- Needs and Challenges
This white paper highlights the technical challenges from a system-level packaging perspective as advanced heterogeneous integrated packages are assembled to the board.
August 2024 Global Sentiment Report
According to IPC’s August 2024 Sentiment of the Global Electronics Manufacturing Supply Chain report, electronics industry sentiment rebounds in August after three-month decline.
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Workforce white paper
Building Electronics Better: A Plan to Address the Workforce Challenges Facing the Electronics Manufacturing Industry
The white paper targets both immediate labor market needs and the long-term sustainability and growth of the industry by building a skilled, adaptable, and motivated workforce. IPC’s ambitious approach is focused on developing rewarding career pathways.
WHITE PAPER
Better Electronics by Design: Next Generation Design Needs
This white paper explores the elements of the "Design for Excellence" methodology, rethinking how it needs to be defined and applied in the full ecosystem of electronics design
iNEMI/IPC White Paper
Complex Integrated Systems: The Future of Electronics Manufacturing
iNEMI/IPC white paper on complex integrated systems highlights future technology and manufacturing ecosystem needs.
Outlook for Data Analytics in the Electronics Manufacturing Industry
The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC’s Chief Technologist Council.
An IPC Report on EU Industrial Policy
Promoting Silicon to Systems Manufacturing
European Industrial Resiliency: Promoting a Silicon to Systems Policy Framework