Venue
MUMBAI, MAHARASHTRA
Shera Hotel, Thane, Belapur Road, Near White House,
Behind Fire Station, TTC Industrial Area, MIDC Industrial Area,
Pawne, Navi Mumbai, MH 400709
Program Schedule
9:30 AM | Registration & Networking Tea |
10:00 AM | Introduction by IPC – Ms. Neha Malviya , Regional Manager, West India |
10:10 AM | Special Address by Guest of Honor |
10:30 AM | Presentation on ESD Best Practices in Electronics by Master IPC Trainer |
12:00 PM | Q & A Session |
12:15 PM | Lunch Break |
01:30 PM | Presentation on Surface Mount Technology in Electronics by Master IPC Trainer |
03:00 PM | Q & A Session |
03:15 PM | Special address by Industry expert |
03:35 PM | Vote of Thanks |
03:45 PM | Networking High-Tea |
Electrostatic Discharge (ESD)
Electrostatic discharge (ESD) is a common cause of damage to electronic components, especially sensitive ones like integrated circuits, transistors, and diodes. ESD occurs when a sudden flow of electricity between two objects with different electric potentials, such as a human body and a circuit board, creates a spark or shock. ESD can degrade, destroy, or alter the performance of electronic components, leading to failures, defect or reduced reliability. Therefore managing ESD risks and preventing damage to electronic components is a crucial aspect of electronics manufacturing
This session introduce participants to the causes of ESD and steps taken to mitigate its effects when handling, storage or transporting ESD-sensitive components in a manufacturing facility. You will learn basic principles and best practices for ESD control and protection.
Surface Mount Technology (SMT)
Surface Mount Technology (SMT) is a pivotal process in electronics manufacturing, enabling the efficient placement of components directly onto the surface of printed circuit boards (PCBs). However, without adherence to best practices, SMT can encounter defects such as tombstoning, solder bridging, and non-wetting, which can compromise the functionality and reliability of electronic assemblies.
This session delves into the common challenges faced during SMT assembly and provides insights into effective strategies to mitigate these issues. Participants will gain a comprehensive understanding of defect causes and learn best practices to enhance process efficiency and product quality.
Who can participate?
This session is ideal for electronics manufacturing professionals—process engineers, technicians, and quality assurance specialists—focused on managing ESD risks and optimizing SMT assembly. Gain practical insights to enhance reliability and efficiency in your production processes.
Note: A maximum 3 Candidates Per Company is eligible for participation.
Registration : Free
Link for Registration
Have Any Query? Please Share with us
Neha Malviya
Regional Manager - West India
NehaMalviya@ipc.org
+91 - 9960098465