IPC Conference Paper Archive

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. weiterlesen

To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real .. weiterlesen

Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad .. weiterlesen

IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application .. weiterlesen

Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab .. weiterlesen

As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee .. weiterlesen

In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space .. weiterlesen

This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit .. weiterlesen

Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem .. weiterlesen

Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d .. weiterlesen

The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de .. weiterlesen

This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more .. weiterlesen

SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line .. weiterlesen

The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u .. weiterlesen

Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma .. weiterlesen

In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad .. weiterlesen

IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of so .. weiterlesen

Crimped electrical contact reliability is controlled through strict manufacturing processes and verifications, including pull force testing. Cable and wire harness assemblies’ standards prov .. weiterlesen

Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu .. weiterlesen

The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol .. weiterlesen

An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being .. weiterlesen

There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem .. weiterlesen

In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma .. weiterlesen

The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result .. weiterlesen

Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi .. weiterlesen

This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it .. weiterlesen

Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u .. weiterlesen

Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s .. weiterlesen

Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co .. weiterlesen

In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe .. weiterlesen

Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga .. weiterlesen

For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h .. weiterlesen

Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec .. weiterlesen

High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and .. weiterlesen

Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This .. weiterlesen

Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in .. weiterlesen

This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final .. weiterlesen

The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges .. weiterlesen

Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi .. weiterlesen

Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising .. weiterlesen

The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu .. weiterlesen

An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy .. weiterlesen

Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal .. weiterlesen

The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p .. weiterlesen

Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C .. weiterlesen

The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s .. weiterlesen

Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin .. weiterlesen

IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th .. weiterlesen

Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To .. weiterlesen

In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold .. weiterlesen