Description To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real time visibility to operational data, and the ability to instantly communicate with “man or machine” via voi .. weiterlesen

Description Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. .. weiterlesen

Description IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application techniques, and coating cure technologies, characterizing the final film thickness on common component sur .. weiterlesen

Description Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliability of PCBA through time. .. weiterlesen

Description As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have been introduced into the fabrication process. .. weiterlesen

Description In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. .. weiterlesen

Description This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification with test data, and failure modes. Three major aspects triggered this investigation. .. weiterlesen

Description Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. .. weiterlesen

Description Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within datacenters. Over the last few decades, data transmission speeds have increased significantly. .. weiterlesen

Description The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). .. weiterlesen

Description This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more we minimize the human intervention required. .. weiterlesen

Description SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. .. weiterlesen

Description The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, using components withstanding high reverse bias voltage. .. weiterlesen

Description Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. .. weiterlesen

Description In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. .. weiterlesen

Description IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of soldering materials through specifications of test methods and inspection criteria. .. weiterlesen

Description Crimped electrical contact reliability is controlled through strict manufacturing processes and verifications, including pull force testing. Cable and wire harness assemblies’ standards provide the minimum pull force for reliable cables. .. weiterlesen

Description Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. .. weiterlesen

Description The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a solder joint. .. weiterlesen

Description An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. .. weiterlesen

Description There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been demanding new innovations. .. weiterlesen

Description In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. .. weiterlesen

Description The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality results in the use of large package components with a high number of I/Os. .. weiterlesen

Description Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivability, a prerequisite that demonstrates reliable copper interconnects. .. weiterlesen

Description This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. .. weiterlesen

Description Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world use is a growing challenge. Undoubtedly, efforts are made to mitigate warpage in both PCB and components. .. weiterlesen

Description Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical system for SMT surface mount technology CCA-circuit card assembly. .. weiterlesen

Description Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective components. .. weiterlesen

Description In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has successfully implemented prototypes and small-scale deployments to employ AI models for quality inspection. .. weiterlesen

Description Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propagates over time and is accelerated by humidity, temperature, and acidity in the environment. .. weiterlesen

Description For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. .. weiterlesen

Description Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelectronic packaging) and a heat spreading component (e.g. .. weiterlesen

Description High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and wearable devices. .. weiterlesen

Description Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This issue is broadly defined as a weak interface between the plated copper and the blind via target pad. .. weiterlesen

Description Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in diameter. .. weiterlesen

Description This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final plated structure. .. weiterlesen

Description The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges such as occur in today’s data center or cloud environments. .. weiterlesen

Description Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in which smoke, electrical arcing, and/or thermal degradation occurs. .. weiterlesen

Description Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising in beyond 5G and 6G society. .. weiterlesen

Description The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment industry away from established technologies and toward novel solutions that use chemical compounds as the prima .. weiterlesen

Description An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), and electron backscatter diffraction (EBSD)(1,2). .. weiterlesen

Description Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. .. weiterlesen

Description The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and perform other functions should be soft and conformable to maximize comfort and effectiveness. .. weiterlesen

Description Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with CMOS component speeds continuously increasing. .. weiterlesen

Description The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical singulation methods. .. weiterlesen

Description Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. .. weiterlesen

Description IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for the surface finishes for printed wiring boards (PWBs). .. weiterlesen

Description Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To control concentration, an extraction system is implemented to remove excess copper. .. weiterlesen

Description In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold is one of the most common processes as it is applied in Ni/Au, Ni/Pd/Au, and Pd/Au finishes. .. weiterlesen

Description This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR4 printed circuit boards (PCBs). .. weiterlesen