IPC has renewed its commitment to serving the industry by expanding the scope and scale of research under a newly created IPC Industry Intelligence (i3) program.
WHAT'S NEW:
An Analysis of the Electronics Industry's Scope 3 Greenhouse Gas Disclosures
Developed in partnership with Anthesis Group, a leading global sustainability consultancy, the white paper provides insights into the complexity inherent in scope 3 reporting and the resource constraints many companies often face.
Lead or Lag: The U.S. Imperative in the Global Chip Race
With funding awards under the U.S. CHIPS and Science Act under review, a new IPC Industry Intelligence Report sheds fresh light on the issues and actors involved.
May 2025 Global Sentiment Report
According to IPC’s May 2025 Sentiment of the Global Electronics Manufacturing Supply Chain report, electronics industry outlook holds steady amid tariff turbulence
Industry Intelligence Insights
Welcome to the MAY edition of our monthly Industry Intelligence Insights. Dive into the latest trends shaping the industry with expert economic analysis, strategic insights, and key market reports to guide your 2025 planning.
Wired for Change: Electronics Industry Sentiment on Sustainability
In a time when many industries are considering – or reconsidering – their commitment to sustainability, IPC wanted to take the pulse of our own industry and understand where companies stand on their sustainability efforts.
IPC White Paper - Navigating E-Mobility Sustainability - Part 1
Evolving Compliance and ESG Requirements for Electronics Suppliers
White Paper
Unlocking AI for Automated Optical Inspection - White Paper
AI has shown significant potential in AOI, particularly in improving detection accuracy, reducing manual intervention, and improving production efficiency.
WHITE PAPER
Why Double Materiality Assessments Matter: Compliance and Competitive Advantage
Empowering the industry with guidance and resources to assist in navigating Corporate Sustainability Reporting Directive (CSRD) obligations.
WHITE PAPER
AI-Based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps
New white paper from IPC explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.
Advanced Packaging to Board Level Integration -- Needs and Challenges
This white paper highlights the technical challenges from a system-level packaging perspective as advanced heterogeneous integrated packages are assembled to the board.
Workforce white paper
Building Electronics Better: A Plan to Address the Workforce Challenges Facing the Electronics Manufacturing Industry
The white paper targets both immediate labor market needs and the long-term sustainability and growth of the industry by building a skilled, adaptable, and motivated workforce. IPC’s ambitious approach is focused on developing rewarding career pathways.