New IPC Video Explains “Advanced Packaging” and the Need for a “Silicon-to-Systems” Industrial Strategy

by Matt Kelly, IPC Chief Technology Officer

In the past, “packaging” semiconductors simply meant protecting them from stresses such as heat and vibration. Today, "advanced packaging” means putting more functional chips into unified packages that boost the power and performance of the overall system.  

"Advanced packaging” has been dubbed “the new king” of innovation in electronics -- at the heart of cutting-edge technologies like AI, self-driving vehicles, 5G and 6G, and quantum computing. 

So, what does “advanced packaging” mean in the context of semiconductors and electronics manufacturing? And why is it so important to the future of the world? Those are the questions answered in simple language and imagery in a new 90-second video released by IPC. Check it out here: www.ipc.org/advancedpackaging.

The new video lays out the need to prioritize investments in advanced packaging to drive innovation, national security, and resilience. It features easy-to-understand animations: one illustrating what advanced packaging is, and another showing how it fits into the supply chains of crucial products as varied as military jets and smartphones.  IPC thanks member company Intel – a global leader in advanced packaging – for providing some of the imagery used in the new video. 

IPC has a long record of advocating for the wider electronics supply chain, including advanced packaging, printed circuit boards, and IC substrates, without which semiconductors cannot function. Just last week, IPC's Technology Solutions group released a new white paper on "Advanced Packaging to Board Level Integration — Needs and Challenges."

Please feel free to share this video and help us educate others on the importance of advanced packaging in electronics manufacturing.