Chief Technologist Council - Vision

About the Council

The Chief Technologist Council is a collection of the electronic industry’s top technology leadership spanning OEM, EMS, component packaging, materials, and PCB companies. Members consist of CTOs, Engineering VPs, Directors, Fellows, Distinguished Engineers, Senior Technical Staff Members, and Chief Engineers. Quarterly meetings will be held throughout the year, discussing various technology and factory of the future topics. The intent of the Council is to obtain VOC (voice of customer) input, keep a pulse on the industry, and to continuously monitor IPC member key plans regarding electronics manufacturing technology needs. Insights will be gathered and reported periodically to various IPC bodies. Council contributions will help shape IPC strategic direction and external communications to industry moving forward.

The Chief Technologist Council is a collection of the electronic industry’s top technology leadership spanning OEM, EMS, component packaging, materials, and PCB companies. Members consist of CTOs, Engineering VPs, Directors, Fellows, Distinguished Engineers, Senior Technical Staff Members, and Chief Engineers.

Council Structure

General Council Members - 20-30 members selected from various supply chain segments OEM, EMS, PCB and key IPC member companies. Council members will consist of members from the following technology leadership roles:

  • Chief Technology Officers
  • Vice Presidents Engineering/R&D/Operations
  • Directors Engineering/R&D/Operations
  • Engineering Fellows
  • Distinguished Engineers/Technologists
  • Senior Technical Staff Members
  • Chief Engineers

 

Intent

The intent of the Council is to obtain VOC (voice of customer) input, keep a pulse on the industry, and to continuously monitor IPC member key plans regarding electronics manufacturing supply chain needs

Objectives

There are several objectives of the Council including:

  • Collaborate w/ key technical influencers globally (IPC members)
  • Use VOC member feedback to shape IPC strategic direction and external communications to industry moving forward
  • Increase value delivery to members; new product, and service offerings that are wanted/needed by members
  • Identify new revenue streams; driving continued IPC growth Y/Y

Segments

  • Automotive 
  • Consumer Electronics  Medical Devices
  • Aerospace 
  • High Performance Computing & Storage 
  • Military/Defense
  • Telecommunications 
  • Industrial

Council Chair - Matt Kelly, IPC Chief Technologist 

Council Members - 

  • Elizabeth Benedetto, Distinguished Technologist, Hewlett-Packard
  • Martin Franke, Head of Research, Siemens
  • Jim Fuller, VP Engineering & Technology Development, Sanmina
  • Tom Geiger, Global Director of Automation, Celestica 
  • Myckel Haghnazari, Director, CTO Office Digital Factory, Flex
  • Matt Kelly, CTO & VP Technology Solutions, IPC
  • Raj Kumar, Sr. Staff Engineer Materials & Process, Northrop Grumman
  • Dale Lee, Staff Design for Excellence Engineering, Plexus Corporation 
  • Thomas Mueckl, VP Global Engineering, Zollner 
  • Colin Reid, Senior Director Digital Factory, Jabil
  • Siva Sivasankar, Reliability Engineering, Google
  • Brian Toleno, Materials Technology Reliability Labs, Meta
  • Jan Vardaman, Founder and President, TechSearch International
  • Neel Venkataraman, Devices and Hardware, Microsoft
  • Jennifer Waskow, Director Engineering Systems, Collins Aerospace
  • Udo Welzel, Autonomous Driving Systems, Bosch
  • Jung Yoon, Distinguished Engineer, Systems Supply Chain, IBM Corporation