| Committee Charter |
The paper will outline key considerations and recommendations for visible inspectable die attach and wire bond
assembly for Automotive applications, including sensors, lighting, transmission controls, and transition to power
electronics and industrial applications. Die attach methods, including epoxy, solder, and sintering. Wire bond
technologies include Au, Cu, Al thin (≤75 um) & heavy wire (>75 um), and Cu ribbon bonding, also including
mechanical tests and visual inspection -manual and AOI-. |
