5-27A System in Package (SiP) Task Group

Chair:

King Jiang, Sky Chip Interconnection Technology Co., Ltd.

Co-Chair:

Liqiang Cao, Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS)

Vice-Chair:

Ying Liang, Huawei Technologies Co., Ltd.

Staff Liaison(s):

Francisco Fourcade