Co-Chair: Brian Chislea, Dow Corporation Vice-Chair: Matthew Eveline, HumiSeal Division of Chase Corporation Staff Liaison(s): Debora Obitz Email: deboraobitz@ipc.org Committee Charter: This task group is responsible for the maintenance of the IPC-HDBK-850 Guidelines for Design, Selection, and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
