6-10D SMT Attachment Reliability Test Methods TG

Chair:

Christina Landon, Naval Surface Warfare Ctr

Vice-Chair:

Vasu Vasudevan, Dell Inc.

Staff Liaison(s):

Debora Obitz

Committee Charter:

This task group is responsible for overseeing the maintenance and development of specific test and performance levels for solder attachment of surface mount devices to rigid, flexible and rigid-flex circuit structures which are based on the guidelines furnished in IPC-970x series standards and the IPC-9301 standard. Some of the standards are maintained jointly with JEDEC.