| Committee Charter |
This task group is developing IPC-9911, Guideline for Automotive Electronics Printed Board Thermal Management & Electronic Component Derating.
This guideline will evaluate the heat transfer mechanisms from printed board assemblies and recommend design requirements and constraints/boundaries, provide comparative analysis between the different mechanisms and suitability of the mechanisms for automotive applications, and recommend methods for verification.
This guideline will also provide evaluations of reliability metrics applicable for automotive electronics, classify printed board assembly components into part types and provide the critical performance ratings for part types. It will also provide recommendations for severity of stress derating to be considered for electronic printed board assembly components during the design process and methods for reliability verification. |
