Chair: Richard Wessel, DuPont Electronics & Imaging Vice-Chair: Steven Bowles, Lockheed Martin Corporation Staff Liaison(s): Doug Sober Email: dougsober@ipc.org Committee Charter: This subcommittee serves as a forum for the discussion and development of new base materials for use in the manufacture of flexible PWBs. This subcommittee is responsible for the maintenance of flexible circuits base materials standards covering flexible base dielectrics (IPC-4202), adhesive-coated dielectric films (IPC-4203) and flexible metal clad dielectrics (IPC-4204).
