| Cochair |
Herb Snogren, Bristlecone LLC |
| Cochair |
Jan Pedersen, NCAB Group AB |
| Staff Liaison |
John Perry |
| Committee Charter |
The D-33-AP Subcommittee is responsible for developing design and fabrication guidelines for printed boards utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm (defined as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing. |
