D-55 Embedded Devices Process Implementation Subcommittee

Co-Chair:

Jeff Seekatz, TTM Technologies - Stafford

Staff Liaison(s):

John Perry

Committee Charter:

This subcommittee is working on revision A of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry. This specification covers qualification and performance of embedded active and passive circuitry within the finished printed board.