2024 award recipients and their university or college of choice to receive scholarships are:

Tiberiu Baranyi, Flex (Politehnica University of Timisoara, Department of Electronics, Telecommunications and Information Technologies)

Zhiman Chen, Zhuzhou CRRC Times Electric Co., Ltd. (Hunan Automotive Engineering Vocational College (HAEVC) 

2023 award recipients and their university or college of choice to receive scholarship are:

Nick Koop, TTM Technologies (University of Minnesota -- College of Science and Engineering)

Thomas Marktscheffel, ASMPT GmbH & Co. KG (University of Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany)         

Curtis Grosskopf, IBM (University of Wisconsin-Madison, College of Engineering)

2022 award recipients and their university or college of choice to receive scholarship are:

Bev Christian, High-Density Packaging User Group (Chemistry Department of New Brunswick University, Fredericton, New Brunswick, Canada)
Doug Pauls, Collins Aerospace (Materials and Science Engineering (MSE) department at Iowa State University, Ames, Iowa)
Jose Servin Olivares, Vitesco (Yecapixtla School of Higher Studies of Morelos State University, Mexico)

2021 award recipients and their university or college of choice to receive scholarship are:

Michael Ford, Aegis Software (Engineering Department, Villanova University, Villanova, Pennsylvania)
Jan Pedersen, Elmatica (University of South-Eastern Norway and Politehnica University, Bucharest, Romania)
Peter Tranitz, Continental Automotive (Physics Department, University of Regensburg, Regensburg, Germany)

2020 award recipients and their university or college of choice to receive scholarship are:

Mike Carano, RBP Chemical Technology, Inc. (Youngstown State University, Youngstown, Ohio)
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center (University of Petroleum and Energy Studies, Dehradun, India)
Udo Welzel, Ph.D., Robert Bosch GmbH (Technical University (TU), Darmstadt, Germany)

2019 award recipients and their university or college of choice to receive scholarship are:

David Adams, Collins Aerospace (Pennsylvania State University College of Engineering)
Lionel Fullwood, WKK Distribution Ltd. (Brigham Young University – Hawaii)
Tino Gonzalez, ACME Training and Consulting (South Dakota School of Mines & Technology)
Cao Xi, Huawei Technologies Co., Ltd. (The Hong Kong University of Science and Technology)

2018 award recipients and their university or college of choice to receive scholarship are:

Stephen Tisdale, Tisdale Environmental Consulting LLC (Thomas J. Watson School of Engineering at Binghamton University)
Linda Woody, LWC Consulting (University of Central Florida)

2017 award recipient and his university or college of choice to receive scholarship is:

Gary Ferrari, FTG Circuits (University of Connecticut, Electrical and Computer Engineering Program)

2016 award recipients and their university or college of choice to receive scholarship are:

Joachim Schuett, FED (Dresden University of Technology’s Electronic Packaging Laboratory and Center of Microtechnical Manufacturing)
Vern Solberg, Solberg Technical Consulting (Santa Clara University’s Electronic Engineering Department)

The recipients of the inaugural 2015 award and their university or college of choice to receive the scholarship are:

Don Dupriest, Lockheed Martin Missile & Fire Control (Texas A&M University-Commerce Foundation)
Denny Fritz, SAIC (Rose Hulman Institute of Technology, Terre Haute, Indiana)
Dave Hillman, Rockwell Collins (Iowa State University, Materials Science & Engineering (MSE) Dept.)
Bernie Kessler, Bernard Kessler & Associates, Ltd. (University of Southern California, John Marshall School of Business)
Bob Neves, Microtek (Changzhou) Laboratories (Pacific Union College, Engineering Dept.)
Ray Prasad, Ray Prasad Consultancy Group (University of Washington, Nanofabrication Facility)
Randy Reed, Viasystems Group, Inc. (South Dakota School of Mines and Technology)
Doug Sober, Shengyi Technology Co. Ltd. (Clarion University, Chemistry Dept.)