8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group
The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metalized terminations that are an integral part of the component body.

During this meeting, the task group will provide an update on the development of content for IPC-7093, review main changes have been made so far for the next revision and brainstorm additional needs for further development.

2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.

This meeting will provide a review of the content of this standard and how it applies to real-world use cases and an opportunity for industry to provide input on expansion of the standard for additional use cases.

9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

During this meeting, the task group will be resolving comments for Revision K.

7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

During this meeting, representatives from the task group A-Team will provide an update on the development of content for IPC-9716, which is scheduled for release this year, and explain areas of the draft that would benefit from additional contributions from industry. The group leadership will also introduce a new standards project for AOI process control for IC substrates and how to participate in that initiative.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity. To fully register for this congress please also register using the following link: https://9th-smart-plastics-congress.b2match.io/

9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.

During this meeting, task group leadership will provide updates on its progress on the next version of this standard as well as an explanation on the benefits of this standard to industry.

IPC-V-TSL-MVIA-EU: Micro Via Task Group
The IPC-V-TSL-MVIA-EU has been raised in 2022 to address microvia reliability in the European HDI PCB supply chain. The objectives of the subcommittee are to gather experts from EU high-rel electronics manufacturing industry, to execute a specific first work proposal, as well as to identify future ones, and to strengthen EU industry presence in IPC standardization on microvias. The leadership of the subcommittee will provide the motivation for the ongoing work, and include a call to participate. Newcomers are welcome!

10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.

During this meeting, the task group will be preparing content for the Final Draft for Industry Review.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

The J-STD-001 Space Addendum is ready for Final Draft for Industry Review, during this meeting the group will discuss the next steps.

1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group
This task group is reviewing the latest IPC-2221C revision release and establishing goals for an Amendment 1 to IPC-2221C and a revision to the IPC-2226A standard for HDI/Microvia Design.

2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.

During this meeting, task group leadership provide updates on the status of a first amendment to IPC-1792 as well as a white paper on how to implement the standard, both of which are scheduled for release this year.

1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group
The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.

The committee will review tests methods, in particular Dielectric Withstanding Voltage, Thermal Shock and Moisture and Insulation Resistance.

Discussion on their suitability in their current form, and to canvass opinions about any needs for revisions. Previous discussion have been conducted on the MIR test, and will recap those conclusions.

3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

During this meeting, the group will be discussing the content and seeking input from industry.

3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee
This subcommittee is developing a white paper outlining the need for future design and fabrication guidelines for printed boards utilizing conductors/spacings below 50 µm and dielectric spacings below 75 µm that are manufactured with semi-additive and modified semi-additive processing.

2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.

During this meeting, attendees will learn about the concepts behind this new standard and how it will apply to real-world usage. Representatives from the task group A-Team will also provide an update on the development of content for the standard and plans it is developing for a proof-of-concept project for this standard using IPC-CFX.

4:30 pm–5:30 pm
7-34: Repairability Subcommittee
The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.

During this meeting, the task group will be seeking input from industry on the recently released Revision D.

8:00 am-8:45 | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–12:00 pm
D-33A and 7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
With the publication of IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards, this joint task group effort will be focusing on industry submissions of photographs for the upcoming Revision M to IPC-A-600, Acceptability of Printed Boards.

D-84A: Plastronics Accelerated Reliability Testing Task Group
The D-84A task group is responsible for the development of IPC-9206 Guidelines for Accelerated Reliability Testing of 3D Plastronics Parts, to enable users to specify a standardized set of testing guidelines to verify the reliability of 3D plastronics end products, such as in-mold electronics and laser surface activated molded integrated devices.

During this meeting, the task group will continue the development phase by reviewing the latest working draft content provided by the A-Teams on high temperature, thermal cycling, and vibration testing guidelines. Discussions on the classification system, applicable testing and definitions.

B-10A: Plastic Chip Carrier Cracking Task Group
The B-10A task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components.

This committee is at the inception of the review and revise of the J-STD-033 and would like to get additional active volunteer support from industry.

D-70: E-Textiles Committee
Task groups within this committee are responsible for maintaining and developing IPC standards for conductive yarn functionality; printed electronics e-textiles reliability; woven, knitted and braided e-textiles functionality; embroidered e-textiles design; reliability of e-textiles wearables and multiple new IPC Test Methods to support requirements in these standards.

During this meeting, leaders from each of the task groups will provide updates on their progress, including IPC-8921A (woven, knitted and braided e-textiles), IPC-8981 (e-textiles wearables reliability) and its 14 new IPC Test Methods, IPC-8961 (e-textiles guideline), IPC/JPCA-8911 (conductive yarn) and IPC-8953 (embroidered e-textiles design requirements). Attendees will learn how they can participate in any of these activities and learn about or propose new e-textiles standards activities.

9:00 am–4:30 pm
7-31F: IPC/WHMA-A-620 Task Group
This task group is responsible for maintaining IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

During this meeting, the task group will be resolving comments for Revision F.

9:00 am–5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 subcommittee establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

During this meeting, the subcommittee will discuss ongoing work related to overhauling the framework of the IPC-175x standards family to be more modular and user-friendly, including the conversion of current XML-based schema to JSON. Individual task group actions will also be discussed as needed, including ongoing revision efforts related to IPC-1751, IPC-1753, and IPC-1755. This is a two-day meeting and participants are encouraged to attend both sessions (Tuesday, 23 January and Wednesday, 24 January).

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–5:30 pm
D-33AA: IPC-6012 Automotive Addendum
The D-33AA task group is chartered with maintaining an addendum to the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, that will provide specific requirements for printed boards in automotive applications.

During this meeting, the task group will provide an update on the development of content for IPC-6012FA, review current working draft and work that has been prepared by A-teams (A-teams topics: microvia, CAF, high-voltage test method, metal base printed boards, end of the life test method).

1-14: DFX Standards Subcommittee
The 1-14 subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

This session will focus on reviewing proposed changes to the IPC-2231A in preparation for FDIR.

D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will review the working draft and resolve a pending discussion on definitions. The group will focus on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

4:30 pm–5:30 pm
7-31J: IPC-A-630 Task Group
The 7-31J task group is responsible for the maintenance of IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures and IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

During this meeting, the group will be reviewing the Final Draft for Industry Review.

8:00 am–9:00 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–3:00 pm
V-EUTG: European Training Group
This is the European Training Group/Committee for ALL IPC Training Programs. Meeting open to ALL training committee members, EU and International. V-EUTG is responsible for reviewing course content, including program translations, and providing recommendations for the training and certification programs.

During this meeting, the group leadership will provide updates on status of certification programs, translation activities and available resources, followed by discussions and comments disposition (if applicable) for each committee: 7-31BT – 610 Training, 5-22BT – 001 Training, 7-31FT- 620 Training, 7-34T – 7711/7721 Training, D-33AT &7-31AT – 6012 & 600 Training, V-TPTG – Training Programs Translation Group. Attendees will learn how they can join a training committee and participate in any of these activities.

9:00 am–12:00 pm
D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

During this meeting, the task group will continue to review the working draft focusing on new and pending comments for resolution to go into Final Draft for Industry Review (FDIR) after this meeting as planned by the leadership.

9:00 am-12:00 pm
2-40: Documentation Committee

This meeting of the 2-40 Documentation Committee is to review proposed changes to the IPC-261x series of documentation documents, including a proposed new document that synthesizes the content of IPC-2611, IPC-2612, IPC-2612-1, IPC-2614, and IPC-2615, and IPC-D-325.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:15 pm
5-21JND: Solder Paste Printing Task Group
This task group is responsible for the maintenance of IPC-7527 Requirements for Solder Paste Application.

During this meeting, the task group will review the updates on the working draft for Revision A in preparation for going into Final Draft for Industry Review (FDIR) after the meeting.

1:30 pm–5:30 pm
5-33C: Conformal Coating Handbook Task Group
The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

The group is in the inception of the review of IPC-HDBK-830 handbook, the committee is collecting new content that is not currently available to the industry. In addition, technical support and guidance is needed to complete the current actions that are open and will be discussed during these meetings.

3:15 pm-5:30 pm
7-31N: Manual Magnification Aides Task Group

The 7-31N task group is responsible for IPC-9904 providing guidelines for manual magnification.

During this meeting, the group will be developing content for IPC-9904.