Microvia Electroplating
Date
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Tuesday and Thursday 5:00 – 7:00 p.m.
Description:
This course, led by industry expert Dr. Despina (DD) Davis, dives deep into the essential techniques and best practices for electroplating in high-density interconnects. Over four weeks, you'll explore the intricacies of plating quality, current calculations, copper kinetics, and pulse plating schemes. Gain hands-on experience with practical case studies and troubleshooting methods to enhance your skills and ensure the reliability of your microvias. Join us online and gain a thorough understanding of:
- Calculating plating currents based on Faraday’s Equation.
- Calculating Current Efficiency.
- Designing pulse plating schemes for double-sided simultaneous plating.
- Troubleshooting why recipes do not match theoretical values.
- Improving copper plating uniformity alternatives.
- Understanding effects of mass transport/diffusion on Microvia Plating → non-steady state process.