Reliability of Electronics – Role of Solder Joint Voids
Date
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Tuesday and Thursday 2:00 – 4:00 p.m.
Course Highlights:
- Identify key causes and effects of solder joint voids
- Explore best practices to minimize voids and improve product reliability
- Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
- Engage with industry-leading knowledge and apply it to your own manufacturing challenges