SMT Manufacturing Productivity & Yield - Mitigating Production Defects II

Learn More
Date
-

Tuesday and Thursday 11:00 – 1:00 p.m.

 

Description:

Module 2 will focus on production defects associated with bare PCB, PCB fabrication, and components – causes, remedies, and preventive measures. In this 4-hour course, you will learn and be updated on the following topics:

  1. Premise
  2. BGA solder ball drop
  3. PBGA crack
  4. BGA/CSP interposer heat damage
  5. BGA/CSP co-planarity issue
  6. Large BGA rework challenge
  7. Ceramic capacitor damage
  8. SOT issue
  9. Tome stoning
  10. 01001 component issue
  11. PCB board sagging
  12. PCB-related issues
  13. PCB pad-cratering
  14. PCB pad lifting
  15. PCB bare board issues
  16. Thermal damages
  17. Concluding summary
 
Learn More