This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. 

This standard establishes the requirements for designing rigid organic printed boards regarding Layout Solvability, Electrical Integrity, Signal & Power Performance on all Layers, etc.

This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.

This standard establishes requirements for the design of organic mounting structure used to interconnect chip components in MCM-L assemblies.

This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards.

This document provides guidelines for the design of high-speed circuitry.

This document provides guidance for the design of manufacturable microwave circuit boards. (This document is not an electrical design guide.) 

This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.

This standard establishes specific requirements for the design of printed electronic applications and related structures on flexible substrates.

The document provides a DFX process framework to establish a discipline of design review necessary to perform a detailed analysis of manufacturability attributes.

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products.

This standard establishes the generic requirements for a document set describing electronic products.

This standard establishes the requirements for the documentation of electronic diagrams for defining the electrical interconnectivity of electronic parts.

This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams.

This standard establishes the requirements for the documentation of printed circuit board fabrication.

The purpose of this Standard is to establish acceptable practices for dimensioning and tolerancing to define end-product requirements for printed boards.

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology.

This document describes the design and assembly challenges for implementing passive and active components into a printed board.

This standard describes design and assembly guidance for implementing bottom termination components (BTCs).

 This document describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly.

This standard describes design and assembly implementation for ball grid array (BGA)  and fine-pitched ball grid array (FBGA) technology.

This document provides generic requirements on land pattern geometries used for the surface attachment of electronic components.