IPC-TM-650 Equipment Vendor Listing
IPC-TM-650 Test Methods refer to many sources of equipment and materials necessary to perform the tests as noted in Section 4, Equipment/Apparatus of each Test Method. Over time, such information within the Test Methods become outdated. The following links constitute a dynamic, non-comprehensive listing of current equipment and/or material vendors as they are provided to IPC staff.
Users and developers of IPC-TM-650 Test Methods are encouraged to contact IPC and provide updated equipment/material sourcing information to keep this listing up to date and accurate. Please send any requests to Deb Obitz via email at DeboraObitz@ipc.org or via phone +1 847-597-2848.
IPC Copper Mirrors for Flux Corrosion List
IPC-TM-650, Method 2.3.32, Flux Induced Corrosion (Copper Mirror Method), defines the procedure for determining the removal effect (if any) of flux on bright copper mirror film which has been vacuum deposited on clear glass.
The following vendors provide copper coated glass slides (mirrors) applicable to this test method. This list is non-comprehensive and is not guaranteed by IPC to be fully accurate, nor are any of the vendors listed endorsed by IPC or members of the IPC 5-24a Flux Specification Task Group. This list is dynamic and IPC recognizes that other capable equipment providers may exist and will be included as IPC is notified.
Vendor | Model | Web site |
EMF Corp. | CU134 or CU136 | https://www.emf-corp.com/copper-slides.html |
If you are familiar with another equipment provider whose copper mirrors/slides meet the requirements of IPC-TM-650, Method 2.3.32, IPC encourages your input. When sending a written email to deboraobitz@ipc.org, please provide your name, e-mail address, and company name.
Ductility/Flex Tester
IPC-TM-650, Methods 2.4.2.1 Flexural Fatigue and Ductility, Foil, 2.4.3.1 Flexural Fatigue and Ductility, Flexible Printed Wiring, and 2.4.3.2, Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics, defines the procedure for determining the flexural fatigue life for any given bend radius, the flexural fatigue behavior and the ductility in (of the metal, only applicable to methods 2.4.2.1 and 2.4.3.2) percent deformation after tensile failure can be determined.
The following vendors provide equipment applicable to this test method. This list is non-comprehensive and is not guaranteed by IPC to be fully accurate, nor are any of the vendors listed endorsed by IPC or members of the IPC D-15 Flexible Circuits Test Methods Subcommittee. This list is dynamic and IPC recognizes that other capable equipment providers may exist and will be included as IPC is notified.
Vendor | Part Number | Web site |
Jovil Universal LLC | 3FD3 Flex Tester Assembly | http://jovil.com/ |
If you are familiar with another equipment provider whose supplies the meet the requirements of IPC-TM-650 Methods 2.4.2.1, 2.4.3.1 or 2.4.3.2, IPC encourages your input. Please provide your name, e-mail address, and company name when providing a written e-mail to DeboraObitz@ipc.org.
IPC Thermal Excursion Simulator List
IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation, defines the procedure for simulating exposure to the thermal conditions of convection reflow assembly.
The test method requires the usage of a thermal excursion simulator capable of meeting the reflow profiles described in the method.
The following vendors provide equipment capable of meeting the reflow profiles within this test method. This list is non-comprehensive and is not guaranteed by IPC to be fully accurate, nor are any of the vendors listed endorsed by IPC or members of the IPC D-32 Thermal Stress Test Method Subcommittee. This list is dynamic and IPC recognizes that other capable equipment providers may exist and will be included as IPC is notified.
Vendor | Model | Website |
APS Novastar | GF-12HT | www.apsgold.com |
ATCO | PRO 1600-RS | www.auto-us.com |
Conductor Analysis Technologies, Inc. |
OM System | WWW.cat-test.info |
Essemtec | RO300FC | www.essemtec-usa.com |
Manncorp | CR-4000 | www.manncorp.com |
HATS-Tester | HATS2 | www.HATS-Tester.com |
If you are familiar with another equipment provider whose simulator meets the requirements of IPC-TM-650, Method 2.6.27, IPC encourages your input. Please provide your name, e-mail address, and company name when providing a written e-mail to deboraobitz@ipc.org.
The following IPC member facilities also provide service for the procedures within this test method:
Company | Website | Phone |
Conductor Analysis Technologies, Inc. | www.cat-test.info | +1 505-797-0100 |
Robisan Laboratory Inc. | www.robisan.com | +1 317-353-6249 |
NTS - Anaheim, CA | www.nts.com/location/anaheim-ca/ | +1 714-999-1616 |
NTS - Baltimore, MD | www.nts.com/location/baltimore-md/ | +1 410-584-9099 |
ATCO | www.atco-us.com | +1 215-364-5588 |
Pacific Testing Laboratories, Inc. | www.pacifictesting.com | +1 661-257-1437 |
Microtek Laboratories China | www.thetestlab.cn | +86 519 8548 7818 |
Solder Mask and Plating Adhesion Pull Test Tape List
IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates.
IPC-TM-650 Test Method 2.4.1, Adhesion, Tape Testing, defines the procedure for using pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with printed boards.
Both test methods require a roll of pressure sensitive self-adhesive film tape exhibiting an adhesive strength of at least 44 N/100 mm [40 oz-force/in] but no more than 66 N/100 mm [60 oz-force/in] as tested per ASTM D3330. This web page provides a non-comprehensive list of tapes meeting this requirement.
This list is dynamic and IPC recognizes that other applicable tape brands may exist and will be included as IPC is notified. None of the brands listed below are endorsed by IPC.
If you are familiar with another tape brand that meets these requirements, IPC encourages your input. Please provide your name, e-mail address, and company name when providing a written e-mail to DeboraObitz@ipc.org . When providing information on an applicable tape brand, please include the company website (if available) in addition to the brand name.
Brand Name | Brand Web Site | Adhesive Strength |
3M Scotch 600 (Industrial Grade – 3 inch Core) |
www.3m.com | 35 N/100 mm [32 oz-force/in] |
3M Scotch 681 | www.3m.com | 44 N/100 mm [40 oz-force/in] |
3M Scotch 371 | www.3m.com | 44 N/100 mm [40 oz-force/in] |
3M Polyester Film Tape 853 | www.3m.com | 52 N/100 mm [48 oz-force/in] |
Nitto Denko Cellophane Tape No.29 |
www.nitto.com | 47 N/100 mm [43 oz-force/in] |
Silver Chromate Paper for Solder Flux Examination List
IPC-TM-650, Method 2.3.33, Presence of Halides in Flux, Silver Chromate Method, defines the procedure for determining the presence of chlorides and bromides in soldering flux by visual examination after placement on test paper.
The following vendors provide silver chromate test paper applicable to this test method. This list is non-comprehensive and is not guaranteed by IPC to be fully accurate, nor are any of the vendors listed endorsed by IPC or members of the IPC 5-24a Flux Specification Task Group. This list is dynamic and IPC recognizes that other capable equipment providers may exist and will be included as IPC is notified.
Vendor |
Product ID |
Web site |
CTL Scientific |
SC-100 Silver Chromate Paper (Box of 100 50 x 50 mm strips) |
If you are familiar with another equipment provider whose test paper meet the requirements of IPC-TM-650, Method 2.3.33, IPC encourages your input. Please provide your name, e-mail address and company name when providing a written e-mail to deboraobitz@ipc.org.