IPC-4103: Specification for Base Materials for High Speed/High Frequency Applications covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition of thermal conductivity of laminates and bonding material, IPC-4103 also allows the use of low permittivity (dielectric constant) glass reinforcements for laminates and bonding materials, thus improving both the permittivity and loss tangent properties of the materials conforming to this specification.

QPL (Qualified Products List) is used to qualify EMS suppliers’ products (including printed circuit boards) and the manufacturing sites where those products are produced. IPC-4103 Companies on our Qualified Products List supply products that have been qualified to IPC standards.