IPC Conference Paper Archive

In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a .. leer más

This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou .. leer más

Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec .. leer más

IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est .. leer más

As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r .. leer más

HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex .. leer más

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. leer más

In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille .. leer más

Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti .. leer más

The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu .. leer más

Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being .. leer más

The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog .. leer más

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. leer más

To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real .. leer más

Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad .. leer más

IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application .. leer más

Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab .. leer más

As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee .. leer más

In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space .. leer más

This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit .. leer más

Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem .. leer más

Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d .. leer más

The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de .. leer más

This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more .. leer más

SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line .. leer más

The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u .. leer más

Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma .. leer más

In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad .. leer más

IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of so .. leer más

Crimped electrical contact reliability is controlled through strict manufacturing processes and verifications, including pull force testing. Cable and wire harness assemblies’ standards prov .. leer más

Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu .. leer más

The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol .. leer más

An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being .. leer más

There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem .. leer más

In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma .. leer más

The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result .. leer más

Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi .. leer más

This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it .. leer más

Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u .. leer más

Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s .. leer más

Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co .. leer más

In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe .. leer más

Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga .. leer más

For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h .. leer más

Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec .. leer más

High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and .. leer más

Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This .. leer más

Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in .. leer más

This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final .. leer más

The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges .. leer más