This one-hour webinar will teach you how to design printed circuit boards (PCBs) that are easy to manufacture, test, and assemble. You’ll learn about three important design principles: Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). These principles help you create PCBs that save time, lower costs, and ensure the final product works as expected.

We’ll explain what DFM, DFT, and DFA mean and why they matter for your design. You’ll see how DFM makes simple PCBs by choosing the right materials, layer stack-ups, and trace sizes. Then, we’ll explore DFT, ensuring your board can be easily tested to catch any issues before production. Finally, we’ll cover DFA, which helps make assembly smoother by correctly placing components and avoiding errors.

Throughout the webinar, we’ll share real-world examples of what happens when these principles are followed—and when they’re not. You’ll also learn about necessary IPC standards, like IPC-2221 and IPC-A-610, that guide good PCB design practices. By the end of the session, you’ll know how to create reliable, cost-effective, and easy PCBs.

This webinar is perfect for anyone working on PCB designs, from beginners to experienced designers. Whether creating your first board or looking to improve your process, this session will give you the tools and tips to succeed. Join us to learn how to design PCBs that work perfectly from the start!

This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc.

Key discussions include:
• Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise.
• DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area.

These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.

IPC, in collaboration with ChemFORWARD, welcome a variety of electronics manufacturing companies including electronics cleaning product formulators to attend this webinar to: Understand the utility of IPC-1402 in defining cleaning products and processes, determining impacts to humans and the environment, managing health and safety and physical hazard requirements, and how to verify and assess relevant criteria.

IPC is teaming up with the U.S. Partnership for Assured Electronics (USPAE) to offer an expert-led discussion on the legal risks related to compliance with the Cybersecurity Maturity Model Certification (CMMC). This discussion will be held on November 19 at 1pm ET and will be led by Eric Crusius, a Partner at Holland & Knight.

Join IPC on November 19 at 4:00 pm EST for a free live event, Economic Outlook 2025, led by IPC Chief Economist Shawn DuBravac. This session is an opportunity to stay informed about the latest economic trends and prepare for the coming year with expert insights.

Discover how to optimize your PCB design process with rigorous constraint management. Join this webinar to learn about the power of model-based PCB design and the importance of digital twins in creating high-quality, manufacturable boards.

Key Topics:
• Model-based PCB design engineering: Understand the benefits and techniques of using models to drive your design process.
• The need for digital twins: Learn how digital twins can provide a comprehensive representation of your PCB, enabling better decision-making and risk mitigation.
• Winning design constraints: Discover effective strategies for defining and implementing design constraints that ensure manufacturability and yield.
• Putting it all together: See how to integrate model-based design, digital twins, and constraint management to achieve optimal results.

Leave this webinar with a clear understanding of how to:
• Create stable and manufacturable PCBs
• Improve design efficiency and reduce errors
• Maximize yield and minimize costs

Don't miss this opportunity to gain valuable insights into the future of PCB design.

In this webinar, we will dive into the Ecodesign for Sustainable Products Regulation (ESPR) and Digital Product Passports (DPPs), providing a clear explanation of what they are and how they work.

Join white paper contributors in a webinar “Next-Generation Electronics Design” on October 14, 2024, at 12:00 pm EDT as they take a deep dive into the subject of design rules and “design for manufacturability.”

When a cyber break-in occurs, the IT team alone will not be able to respond to the attack. The detection is limited to what is available from the IT and network equipment, as opposed to the normal day-to-day behavior that is available to the IT team. Differences from the normal behavior of the production line can only be detected on the production line. No matter how good the IT system is, if the initial response of the people on the production line is slow, the impact of a cyber incident will be much greater. Today, the electronics manufacturing industry is shifting from China, Europe, and the United States to Southeast Asia, including Vietnam, India, and Thailand. Local education and onsite practice is essential.

In this webinar, participants will learn about exercises and best practices for Business Continuity Disaster Recovery (BCDR). This knowledge will help understand what needs to be accomplished at their local factories.

The weakest link in the supply chain can be a target, as demonstrated by the Japanese auto plant that was forced to shut down due to an attack on a single supplier. By applying the lessons from this webinar, participants will be well-prepared for potential cyber attacks, minimizing the risk to their entire, interconnected supply network and the broader electronics manufacturing industry. It is an action that will not be specified in the requirements of the IPC standard for cybersecurity (IPC-1792), but will be mandatory for implementation. The following topics will be covered:

-Practice Demands
-Recognition of current and goal setting
-Preparation (awareness creation)
-Business Continuity Disaster Recovery (BCDR)
-Characteristics of the factory
-Criteria for detection and judgment (risk extraction method)
-Differentiation between failure and attack
-Process of early recovery
-Guidance for BCDR measures policy (BCDR viewpoints, characteristics of factories, requirements for BCDR)
-Overview of BCDR measures
-Conduct incident response practice
-IPC-1792 and practice

Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.