A Deep Dive of Applying AI in Electronic Manufacturing
The rapid growing availability and maturity of AI (Artificial Intelligence) technology is creating new paradigm in smart manufacturing and Industry 4.0 transformation for manufacturing industry, including electronic manufacturing sector. There is great potential to apply AI in electronic manufacturing processes to assure product quality with significant efficiency improvement and cost reduction. However, a successful AI adoption has critical dependency on the careful analysis of business processes and data availability of the use case. It requires deep expertise and knowledge in both AI and the use case domain to deliver the expected ROI (return of investment) for AI adaption.
This webinar will focuses on two types AI technologies: Computer Vision AI and LLM (Large Language Model) Generative AI. A deep dive on the following topics will be discussed, with reference of technical papers published by IBM and iNEMI.
- Current state-of-art Computer Vision AI and Generative AI technology
- Analysis of business processes and use uses
- Reference architecture and methodology for AI adoption
- The associated challenges in security, privacy, cost and capability
Speaker Bio
Feng Xue is a dynamic leader in semiconductor technology and supply chain operations, currently serving as a Senior Technical Staff Member at IBM Infrastructure's Supply Chain Engineering division. With over two decades of experience, Feng has honed his expertise in the field, making significant strides in his role as Chief Architect for Supply Chain Quality System Solutions.
Feng spearheads initiatives that revolutionize internal quality management systems, enhance supplier quality programs, and drive business analytics. His innovative approach to app modernization and cloud-native applications for quality processes has set new standards in the industry. Additionally, Feng is at the forefront of deploying AI solutions and leading the charge in Industrial 4.0 transformation. His commitment to engineering skill development and technical leadership is evident in his impactful work.
Since 2022, Feng has been an active member of IPC, where he currently chairs the 7-25A Automated Optical Inspection Process Control Standard Task Group and the 7-25B Automated Optical Inspection Process Control for IC Substrates Standard Task Group. He also contributes as a member of the A-team for 2-10-AT3 The Strategy Seekers, showcasing his strategic vision and dedication to advancing industry standards.
The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand.