Cyber Disaster Recovery Exercises for Electronics Manufacturers

Date
- (6:00 - 7:00am CDT)

When a cyber break-in occurs, the IT team alone will not be able to respond to the attack. The detection is limited to what is available from the IT and network equipment, as opposed to the normal day-to-day behavior that is available to the IT team. Differences from the normal behavior of the production line can only be detected on the production line. No matter how good the IT system is, if the initial response of the people on the production line is slow, the impact of a cyber incident will be much greater. Today, the electronics manufacturing industry is shifting from China, Europe, and the United States to Southeast Asia, including Vietnam, India, and Thailand. Local education and onsite practice is essential.

In this webinar, participants will learn about exercises and best practices for Business Continuity Disaster Recovery (BCDR). This knowledge will help understand what needs to be accomplished at their local factories.

The weakest link in the supply chain can be a target, as demonstrated by the Japanese auto plant that was forced to shut down due to an attack on a single supplier. By applying the lessons from this webinar, participants will be well-prepared for potential cyber attacks, minimizing the risk to their entire, interconnected supply network and the broader electronics manufacturing industry. It is an action that will not be specified in the requirements of the IPC standard for cybersecurity (IPC-1792), but will be mandatory for implementation. The following topics will be covered:

-Practice Demands
-Recognition of current and goal setting
-Preparation (awareness creation)
-Business Continuity Disaster Recovery (BCDR)
-Characteristics of the factory 
-Criteria for detection and judgment (risk extraction method)
-Differentiation between failure and attack
-Process of early recovery
-Guidance for BCDR measures policy (BCDR viewpoints, characteristics of factories, requirements for BCDR)
-Overview of BCDR measures
-Conduct incident response practice
-IPC-1792 and practice

Speaker Bios

Hiroyuki Watanabe October 31

Hiroyuki Watanabe is engaged in activities to disseminate and enlighten the future of the manufacturing industry from the perspective of security and the international economy. He has published two Japanese books and one English book to support security measures in small and medium-sized factories. He presents logical findings leading to know-how and necessity of security measures for factories and supply chains at the Counterfeit Symposium and APEX. He publishes his cybersecurity findings under IPC's Technical Leadership Program.

Since 2018, he has been a visiting researcher at the Center for Rule Formation Strategy, Tama University. Hiroyuki Watanabe is currently the Executive Director of Global Security at NEC Corporation. In 2020, he joined the IPC Board of Directors and is a chair of IPC-1792 Cybersecurity Standard.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.” 

The white paper explores the packaging and integration needs for several key application areas:

  • High Performance Computing (HPC)
  • 5G/6G Wireless Communications
  • Autonomous Driving and Electric Vehicles (EV)
  • Medical Electronics
  • Aerospace & Defense Electronics

The paper then analyzes the following aspects of advanced packaging to board-level integration:

  • Design challenges and co-design approaches
  • Power delivery requirements
  • Thermal management challenges 
  • Materials innovation needs for package assembly and PCB integration
  • Printed Circuit Board Assembly (PCBA) challenges
  • Reliability considerations for heterogeneously integrated   systems
  • Metrology requirements for the characterization of advanced packaging to board level assembly

The white paper emphasizes the importance of a “silicon to systems” approach in developing next-generation chiplet-based advanced packages and their integration into complex systems. The paper also recommends the development of a 5-10 year outlook on trends, challenges, and gaps in advanced electronic packaging and PCB/subsystem integration across various application domains. This roadmap will enable the electronics industry supply chain to better prepare for and address the complex challenges in system-level packaging and integration.

“IPC is committed to identifying the gaps and challenges in design, materials, assembly, test, and reliability as applied to advanced packaging integration with printed circuit boards, assemblies, and subsystems,” said Devan Iyer, chief strategist advanced packaging and white paper co-author. “Along with our industry partners, IPC will continue to be the leading advocate of a ‘silicon-to-systems’ approach as the evolution of advanced packaging directly affects the future of all aspects of electronics manufacturing,” emphasized Matt Kelly, IPC chief technology officer and white paper co-author. 

This white paper provides valuable insights for anyone involved in electronics manufacturing, helping them stay ahead of technological trends and address future integration challenges effectively.

Download the White Paper.

IPC Day Italy Maranello (Ferrari Museo)

Date
- (2:00 - 9:00am CDT)

Shaping the Electronics of the Future: Ensuring Quality & Long-Term Reliability through Standards

Join us for the 2024 IPC Day Italy, taking place on Thursday 3 October 2024 at the Ferrari Museo in Maranello. 
IPC DAY Italy will focus on ensuring quality & long-term reliability of electronic devices through standards as well as sustainability, especially in the automotive industry. The IPC Day is organised in a partnership with Gestlabs & Phoenix Contact with industry sponsors TTI, NCAB, & JBC. Table-top exhibitions will be available on the day. 

Stay up-to-date on IPC Standards, discover the latest advancements in electronic assembly design & production & learn sustainable practices to protect the environment & create value for future generations.

Why Attend IPC Day Italy 2024?

Join & connect with experts & industry professionals to exchange & learn best practices in IPC standards. Direct interaction with Italian industry experts and IPC will allow you to stay up to date on standards to adopt & learn guidelines for identifying methods & procedures to create reliable & cutting-edge products.
Participation fee is 100,-EUR per person, including a VIP PASS to the Ferrari Museo, a dedicated guided tour & networking lunch.

Where: Convention Center, Ferrari Museo, Maranello, Italy 

When: Thursday, 3 October 2024, 09:00 - 16:00 h

Who should attend: 

  • Manufacturing, quality & design engineers
  • Members of Academia
  • Senior & junior engineering students
  • Specialists or practitioners in manufacturing (especially automotive & related)


Participation Fee: 100,- EUR per person, including the VIP pass to the Ferrari Museum

Please register by 16 September 2024. Follow the link to access the registration form and FAQ section: https://gestlabs.phoenixcontact.it/ipc-day-italy-2024

Please note that registration is limited to two participants per company. For more information you can email Ms. Francesca Sambero or phone +39 039 855 1014 ext. 2. 
 

Ferrari Museo

Via Paolo Ferrari 85
41121 Modena MO
Italy

Ferrari Museo

Ferrari Museo
Via Paolo Ferrari 85
Modena, MO 41121
Italy

Electrical Wire Processing Technology Expo 2025

Date
-

Why Attend the Electrical Wire Processing Technology Expo (EWPTE)?

Produced by WHMA/IPC, the ONLY trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers and customers, EWPTE is where the industry comes together with more than 3,000 attendees and nearly 200 exhibitors to find solutions to challenging wire problems through training and education and for the opportunity to network with industry leaders and subject matter experts.

Attendees at all career stages can expect to Harness the Future through:

Education & Training
Professional Development Courses with content designed to deliver new information, skills, and techniques related to the cable and wire harness industry. 

Technical Conference Sessions presented by engineers, researchers, academics, technical experts, and industry leaders who will share new technical data, significant results from experiments and case studies, emphasizing new techniques and discussing trends of interest with appropriate technical test results.

Networking Opportunities by connecting with industry leaders and subject matter experts.

Accessing New Technologies and finding new suppliers to find solutions to your challenging wire problems on the show floor from nearly 200 exhibitors.

Who Should Attend?

Anyone who designs, specifies, purchases, installs, sells, maintains or manufactures electronic cable assemblies, cord sets, wiring harnesses and other related products for the following industries:

  • Aerospace
  • Automotive/Transportation (Automobiles, Rail, Buses. Trucks)
  • Consumer Technology (Business Equipment and Appliances)
  • Defense/Military
  • Medical Instruments
  • Off Highway (Constructions, Agriculture and Mining)
  • Recreational (RV, Marine OPE & RTV)
Baird Center

400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Baird Center

Baird Center
400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Calling All California Employers: Harness State Funding for Workforce Training with IPC and ETP

IPC announces a pivotal opportunity for California employers under the Employment Training Panel (ETP) program. This initiative provides significant financial support for customized job skills training, reducing costs and enhancing the competencies of the workforce in today's challenging market.

Why Partner with IPC and ETP?

The collaboration between IPC and ETP offers a host of benefits:

  • Offset Costs: IPC receives reimbursements from ETP for training expenses, which drastically cuts or even eliminates your training costs.
  • Flexibility: Employers can select training programs that align perfectly with their workforce needs.
  • Customization: Tailored training that caters to specific industries and job roles, ensuring relevant and impactful learning experiences.

Who Stands to Gain?

  • Any employer with one or more full-time employees
  • Businesses contributing to the State Unemployment Insurance system
  • Particularly small businesses, with 74% of ETP-supported enterprises being small-scale operators.

Maximizing Business Potential

Employers are encouraged to act swiftly to leverage this advantageous program and drive business growth through enhanced skills and innovation. For more information on how IPC and ETP can provide assistance, contact Victoria Hawkins, IPC director of workforce grants and funding, at VictoriaHawkins@ipc.org.

IPC New England EMS Leadership Roundtable: Leveling Up Your Business

Date
- (3:00 - 7:00pm CDT)

October 22, 2024 | 4:00 pm – 8:00 pm
Location: Cirtronics Corporation
528 Rte 13 S, Milford, NH 03055

(603) 249-9190
www.cirtronics.com

Hosted by: Cirtronics Corporation

Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue and employee retention, and how AI may impact the business in the future. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. Discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends in unique takeaways. 

Complimentary registration includes: 
•    Peer-led roundtable discussions
•    Updates on relevant EMS industry studies/reports
•    Recap of business resources available
•    Reception and dinner
•    Peer networking, partnership building 

Have questions? Email Mark Wolfe at MarkWolfe@ipc.org.

Cirtronics Corporation

528 Rte 13 S
Milford, NH 03055
United States

Cirtronics Corporation

Cirtronics Corporation
528 Rte 13 S
Milford, NH 03055
United States

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025

Deadline for proposals: November 8, 2024

WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis.

Expert technical conference presentations and professional development courses are being sought in the following topic areas:

  • Case Studies on A-620 Success
  • Quality Requirements
  • ESD Impacts on Harness
  • ESD Transmission through Harnesses
  • Hi Frequency Cabling
  • X-ray Inspection Techniques
  • Crimping Challenges/Dos and Don’ts
  • Crimp Cross Sectioning
  • Wire Harness Troubleshooting
  • Reliability Issues and Failure Analysis
  • Wiring Harness Education and Training
  • Coil Winding
  • Connector Advances
  • Tooling
  • Process Equipment/Productions
  • Calibration
  • Ultrasonics Splicing and Terminating
  • Harness Design Drawings Engineering
  • Overmolding
  • Testing – Electrical/Environmental/
    Mechanical
  • Electric Vehicles (EV)/Electric Mobility
  • Cleanliness and FOD
  • Wiring Harness Rework

Proposals must include an approximate 300-word abstract/summary of the presentation and description of what the audience will learn, and who will benefit from attending the presentation. Technical conference paper abstracts and course proposals are due November 8, 2024. For more information or to submit a proposal, visit https://app.oxfordabstracts.com/stages/75906/submitter. For questions regarding the technical conference at EWPTE, contact Julia Flynn, IPC/WHMA conference and events manager, at JuliaFlynn@ipc.org.

For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact Alicia Balonek, IPC/WHMA senior director of trade shows and events at AliciaBalonek@ipc.org.