North American EMS Industry Up 0.2 Percent in March

IPC releases EMS industry results for March 2025

IPC announced today the March 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.37.

Total North American EMS shipments in March 2025 were up 0.2 percent compared to the same month last year. Compared to the preceding month, March shipments were up 4.2 percent. March’s year-to-date (YTD) shipments decreased by 0.3% year-over-year (YOY).

EMS bookings in March increased 12.7 percent year-over-year and increased 10.5 percent from the previous month. March’s YTD bookings increased 4.0% compared to the same period last year.

“March bookings jumped as buyers raced to get ahead of mounting uncertainty. Concerns over geopolitical tensions and potential tariff hikes have prompted preemptive orders as firms look to secure inventory before conditions worsen,” said Shawn DuBravac, IPC’s chief economist. “But while bookings surged, shipment growth remained relatively flat, reminding us that order volumes have a natural ceiling dictated by production capacity limitations.”

March 2025 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

 

IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada

IPC announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth. 

 

In this role, Schneider is responsible for ensuring that the needs of this vital region’s electronics industry are clearly understood and served by IPC and accomplished by developing strong relationships with regional membership, customers, and partners along with providing exceptional service delivery and identifying new business opportunities throughout the electronics eco-system.

 

With an impressive resume, Schneider brings more than two decades of executive experience with very successful roles and increasing responsibility in the EMS industry (Flex, Sparton) and the medical devices industry (Abbott, Siemens Healthcare). Immediately prior to joining IPC, he served as the vice president of commercial operations, health solutions for Flex in Buffalo Grove, Ill. While there, he led multi-site operations responsible for medical device, equipment and drug delivery for the healthcare industry.

 

“As our members, partners and other industry stakeholders meet Joe and see him in action, it will become very apparent that developing strong relationships with our targeted community and finding creative ways to address their challenges are part of his natural DNA. We look forward to him implementing the right strategies to better know the industry and in parallel fulfill our mission to serve the membership,” said Sanjay Huprikar, IPC’s chief global officer. 

 

Schneider is based from IPC’s corporate headquarters in Bannockburn, Ill., and can be reached at JoeSchneider@ipc.org.

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing. 

 

Version 2.0 provides substantial updates or expansions to support a broader range of shop floor operations. This includes capabilities added for hand soldering and wave soldering operations – expanding the total number of supported device types to 14 – and providing a pathway for gateway solutions providers to demonstrate their CFX capabilities via the CFX Validation and Qualification System. 

 

Additionally, CFX version 2.0 includes new capabilities, message additions, and structural changes to support smarter factory operations, including, for example:

  • New messaging to support Automated Guided Vehicle (AGV) and Autonomous Mobile Robot (AMR) technologies deployed in a CFX environment
  • Message field added to enable traceability of specific PCB differences (e.g., board vendor identification), which can be used to influence inspection outcomes and process optimization

  • SMT placement capabilities extended to include pick-and-place cycle information for each component to provide a detailed view of component placement and any failed pickup attempts on the machine and capture how many consecutive pickup attempts occurred before a placement error 

  • Improved handling of dynamic recipe changes during production by logging any on-the-fly modifications an operator makes to an active recipe at the equipment level

 

As with all previous IPC-2591 CFX releases, the CFX version 2.0 software development kit (SDK) is backward compatible with previous versions of the CFX SDK.

 

“Each of these enhancements in IPC-CFX 2.0 was driven by real-world manufacturing needs and vetted by the IPC task group to maintain compatibility with earlier versions,” said Thomas Marktscheffel, director of product management software solutions at ASMPT. “The result is a more expansive and detailed standard that covers a broader array of production processes and delivers richer data from machines, enabling smarter analytics and more efficient operations across the connected factory.”

 

To purchase IPC-2591, Version 2.0, visit the IPC Store.

 

For more information on CFX, including access to the latest SDK and software development resources, visit www.ipc-cfx.org.

 

Road to Reliability: Design for Reliability - a Technology Solutions Webinar Series for e-Mobility Electronics Hardware Reliability

Date
-

We are delighted to welcome Marius Tarnovetchi of Schaeffler, Olaf Schoenfeld of Zestron, and Andy Mackie of Indium to explore the critical role of Design for Reliability (DfR) in advancing e-Mobility. 

This panel discussion will cover PCB Design for high voltage, harsh environments, physics of failure, thermal management, and the impacts of technical cleanliness on the reliability of power electronic assemblies. It will also cover components, interconnects, and systems integration. 

Our "Road to Reliability" series aims to bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. We will examine reliability drivers, technology applications, and target lifecycles.

 

Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship

IPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship. Regional country competitions will take place between March and December 2025 and final championship will be held at IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) event scheduled January 29–30, 2026, in Bangalore, India. The global initiative promotes industry’s best practices and strengthens the skilled workforce behind cable and wire harness assembly.           

 

Country wire harness competitions will take place in China (March 27-28), Sri Lanka (April 4), Australia (May 7), UAE (May 8), Vietnam (May 16 and September 10-12), Malaysia (July 23-25), Saudi Arabia (July), Thailand (August 20-22), Mexico (August), Philippines (October), and Egypt (November).                                                     

 

The global competition will bring together top talent from across the world to compete, collaborate, and showcase the highest standards of craftsmanship in wire harness assembly—an essential function in modern electronics manufacturing.

 

The competition will follow IPC/WHMA-A-620 Revision E, the industry benchmark for quality and reliability in the cable and wire harness industry. Participants will be evaluated on a wide range of competencies, including wire preparation, crimping, soldering, BOM verification, and final assembly workmanship. 

 

The World Wire Harness Competitions and Championship come at a time when the global wire harness market is poised for substantial growth. With a projected compound annual growth rate (CAGR) of 7.2 percent between 2024 and 2034, the sector is expanding across automotive, aerospace, defense, and industrial applications. 

 

“The wire harness competitions and subsequent championship are a global celebration of craftsmanship, collaboration, and excellence—bringing the best of each region together to inspire and celebrate the beauty inside of our craft and the people,” said Parker Garrett, EMSCO, chairman, WHMA.

 

Positioned as a centerpiece of IEMI 2026, the championship is expected to attract worldwide attention from leading manufacturers, industry stakeholders, and innovation-driven enterprises. For more information on regional rounds, sponsorship opportunities, or participation guidelines, visit: www.ipc.org/ipc-india-Wireharness-2025.

IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President

IPC announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth. 

 

Sessine will spearhead IPC’s comprehensive communications strategy through high-impact industry partnerships, strategic media relations, social and digital engagement, and brand building initiatives. As the association’s chief reputation steward, she will collaborate with key stakeholders across IPC’s global ecosystem to develop powerful initiatives that positively impact the organization’s reputation and elevate the electronics industry’s profile and its most pressing issues.

 

With an impressive resume, Sessine has two decades of experience in corporate communications, reputation management, marketing, brand building and public relations. Prior to IPC, she served as the senior vice president of marketing & communications for In-Q-Tel, Inc., in Tysons, Va. While there, she led marketing and communications, directed a brand refresh, established crisis communications strategies, developed external content platforms and programming, and directed large-scale conferences.

 

Prior to her work at In-Q-Tel, Inc., Sessine led an independent strategic communications consultancy for clients in life sciences, pharma, biotech, corporate, and consumer packaged goods.

 

“Our decision to hire Carrie, above all, is a testament to her robust credentials. She has a demonstrated history of successfully working in the tech industry, protecting, and enhancing brand and corporate reputations,” said Dr. John W. Mitchell, IPC president and CEO. “Carrie is an immersive storyteller and stresses the importance of engaging audiences through fostering connections. Collaborating with her team, Carrie will help position IPC and the electronics industry as a driving influence in the world.”

 

Sessine is based in the Washington, D.C. area and can be reached at CarrieSessine@ipc.org.         

A Deep Dive of Applying AI in Electronic Manufacturing

Date
-

The rapid growing availability and maturity of AI (Artificial Intelligence) technology is creating new paradigm in smart manufacturing and Industry 4.0 transformation for manufacturing industry, including electronic manufacturing sector. There is great potential to apply AI in electronic manufacturing processes to assure product quality with significant efficiency improvement and cost reduction. However, a successful AI adoption has critical dependency on the careful analysis of business processes and data availability of the use case. It requires deep expertise and knowledge in both AI and the use case domain to deliver the expected ROI (return of investment) for AI adaption.

This webinar will focuses on two types AI technologies: Computer Vision AI and LLM (Large Language Model) Generative AI. A deep dive on the following topics will be discussed, with reference of technical papers published by IBM and iNEMI. 

- Current state-of-art Computer Vision AI and Generative AI technology

- Analysis of business processes and use uses

- Reference architecture and methodology for AI adoption

- The associated challenges in security, privacy, cost and capability

Speaker Bio

Feng Xue May 14 2025

Feng Xue is a dynamic leader in semiconductor technology and supply chain operations, currently serving as a Senior Technical Staff Member at IBM Infrastructure's Supply Chain Engineering division. With over two decades of experience, Feng has honed his expertise in the field, making significant strides in his role as Chief Architect for Supply Chain Quality System Solutions.

Feng spearheads initiatives that revolutionize internal quality management systems, enhance supplier quality programs, and drive business analytics. His innovative approach to app modernization and cloud-native applications for quality processes has set new standards in the industry. Additionally, Feng is at the forefront of deploying AI solutions and leading the charge in Industrial 4.0 transformation. His commitment to engineering skill development and technical leadership is evident in his impactful work.

Since 2022, Feng has been an active member of IPC, where he currently chairs the 7-25A Automated Optical Inspection Process Control Standard Task Group and the 7-25B Automated Optical Inspection Process Control for IC Substrates Standard Task Group. He also contributes as a member of the A-team for 2-10-AT3 The Strategy Seekers, showcasing his strategic vision and dedication to advancing industry standards.

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

Reliability of Electronics – Role of Solder Joint Voids

Date
-

Tuesday and Thursday 2:00 – 4:00 p.m.

 

Course Highlights:

  • Identify key causes and effects of solder joint voids
  • Explore best practices to minimize voids and improve product reliability
  • Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
  • Engage with industry-leading knowledge and apply it to your own manufacturing challenges
 

Introduction to PCB Design I (Southeast Asia)

Date
-

Tuesday and Thursday 10:00 am – 12:00 pm

 

Upon completion, participants will be able to:

  • Define and create schematic symbols and PCB footprints that comply with applicable IPC Standards
  • Create simple schematics for use in simulation and prototyping applications
  • Implement industry best practices for:
    • Schematic capture
    • Hierarchical design implementation
    • Documentation
    • Parts list generation
  • Recognize the trade-offs between the different schematic methodologies and when to use each type
  • Assess different component types and attachment methods
    • Differentiate when to use each type of component
  • Define standard schematic notes
    • Apply best practices in negotiating these terms with customers