PRODUCT ASSURANCE
8:00 am-10:00 pm
7-31FHV IPC/WHMA-A-620 Task Group
Developing a standard for high voltage cable applications in the electric mobility industry.
7-32C Electrical Continuity Testing Task Group
IPC-9252 revision development for electrical continuity testing concepts and guidelines.
D-33 Performance Standards Subcommittee
IPC-6011 revision development for printed board performance.
8:00 am-12:00 pm
7-31F IPC/WHMA-A-620 Task Group
IPC/WHMA-A-620 revision development for cable and harness processes and acceptance.
1:30 am-3:00 pm
4-14F Final Finishes for Printed Boards – ENEPIG Task Group
Discussing development of requirements for ENEPIG finishes for printed boards.
7-31FT IPC/WHMA-A-620 Training Committee
IPC/WHMA-A-620 Certification Program training materials discussion, development, evaluation and revision.
1:30 pm-5:00 pm
7-31J Electronic Box Assemblies Task Group
IPC-A-630 revision development for electronic enclosures (box build).
ASSEMBLY AND JOINING
8:00 am-10:00 am
5-21H Bottom Termination Components (BTC) Task Group
IPC-7093 revision development for design and assembly challenges for implementing Bottom Termination Components (BTCs).
5-23B Component and Wire Solderability Specification Task Group
J-STD-002 revision development for component lead, termination, lug, terminal and wire solderability.
10:15 am-12:00 pm
5-23A Printed Circuit Board Solderability Specifications Task Group
J-STD-003 revision development for printed board solderability.
10:00 am-5:00 pm
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
J-STD-001 and IPC-A-610 Automotive Addendum revision development.
BASE MATERIALS
8:00 am-12:00 pm
3-11A IPC-4101 Task Group
IPC-4101 revision development for base materials.
1:30 pm-3:00 pm
3-12D Woven Glass Reinforcement Task Group
IPC-4412 revision development for performance of woven glass fabrics and their effect on laminate and prepreg manufacture.
3:15 pm-5:00 pm
3-12E Base Materials Roundtable Task Group
Generate ideas for task groups involved in printed base materials.
CLEANING AND COATING
8:00 am-12:00 pm
5-32G Residue Assessment Task Group
Discuss methods of evaluation and assessment of residues found on printed boards and printed board assemblies.
ELECTRONIC PRODUCT DATA DESCRIPTION
8:00 am-11:00 am
2-17A and 2-17B IPC-2591 and IPC-HERMES-9852 Joint Task Group
IPC-HERMES-9852 revision development for omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.
8:00 am-12:00 pm
2-18 Supplier Declaration Subcommittee
Discuss the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration.
11:00 am-12:00 pm
2-12C Cybersecurity Protection Standard Task Group
IPC-1792 revision activities for cybersecurity management in the manufacturing industry supply chain.
3:15 pm-5:00 pm
2-19A Critical Components Traceability Task Group
IPC-1782 revision development for manufacturing and supply chain traceability of electronic products.
PROCESS CONTROL
8:00 am-12:00 pm
7-31M Fiber Optic Cable Acceptability Task Group
IPC-A-640 and IPC-D-640 revision activity for optical fiber, optical cable and hybrid wiring harness assemblies.
MANAGEMENT
10:00 am-12:00 pm
V-TPAC IPC Training Program Advisory Committee
Advising IPC on the development, maintenance and creation of IPC Certification and Training programs and reviews, supports and aligns the activities of the IPC Certification and Training Committees with IPC strategy.
DATA GENERATION & TRANSFER/DOCUMENTATION
10:15 am-5:00 pm
2-40 Electronic Documentation Technology Committee
Developing strategies and recommendations for the conversion of design and manufacturing information into electronic formats representing final product.
1:30 pm-5:00 pm
2-18A Generic Requirements for Declaration Process Management Task Group
Developing the format and XML characteristics for material and substance declaration.
RIGID PRINTED BOARDS
10:15 am-12:00 pm
D-33-AP Ultra HDI Subcommittee
Developing design and fabrication guidelines for printed board utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.
1:30 pm-3:00 pm
EA Roundtable
DoD Executive Agent discussion on printed circuit board & interconnect technology.
3:15 pm-5:00 pm
D-35 Printed Board Storage and Handling Subcommittee
IPC-1601 revision activities printed board handling and storage guidelines.
PRINTED ELECTRONICS
1:30 pm-3:00 pm
D-61B and D-64B Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification Joint Meeting
IPC-2294 and IPC-6904 revision activities for design, qualification and performance of printed electronics on rigid substrates.
TERMS AND DEFINITIONS
1:30 pm-3:00 pm
2-30 Terms and Definitions Committee
IPC-T-50 revision activities for terms and definitions for interconnecting and packaging electronic circuitry.
FABRICATION PROCESSES
3:15 pm-5:00 pm
4-14B Final Finishes for Printed Boards - ENIG Task Group
IPC-4552 revision activities in the development of technical information, guidelines and testing techniques to evaluate electroless nickel / immersion gold (ENIG) as a surface finish for printed boards and interconnecting substrates.