Onshoring: Advanced Packaging and Assembly Workshop

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IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 28-May 1, 2025, at the Sheraton Pentagon City Hotel, Arlington, Va. 

This workshop will be bringing Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging.  The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III), and DARPA will be briefing on their advanced packaging programs.

The workshop will feature three days of focused sessions, keynote presentations, a panel discussion, and a variety of networking opportunities. The event will kick-off on Monday with a pre-program day filled with 2-hour professional development courses and/or additional working groups addressing a variety of topics relevant to the onshoring of advanced packaging.  The 2025 Workshop will also feature networking opportunities with sponsors and tabletop exhibitors.

Attendees for the Workshop MUST be U.S. Citizens with a current and valid U.S. passport. Industry Day (on Thursday) and Professional Development Courses are open to registered US Citizens and non-US citizens.   

Sheraton Pentagon City Hotel

900 South Orme St.
Arlington, VA 22204
United States

Event Venue Website
https://www.marriott.com/event-reservations/reservation-link.mi?id=172235476937…

Sheraton Pentagon City Hotel

Sheraton Pentagon City Hotel
900 South Orme St.
Arlington, VA 22204
United States

MORE INFORMATION/REGISTER

Sartorius Lab Instruments GmbH & Co. KG, First German EMS Company to Receive IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Sartorius Lab Instruments GmbH & Co. KG. Sartorius is a leading international provider to the biopharmaceutical research and medical industry. Sartorius Electronics, a manufacturing arm of Sartorius Lab Instruments GmbH & KG (SLI), provides high-quality electronic subassemblies that are produced for end products used worldwide throughout the Sartorius Group.

 

Sartorius Electronics is the first German company to complete an intensive audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.

 

For many years, Sartorius Electronics has utilized both IPC J-STD-001 and IPC-A-610 standards in its organization, meeting customers' quality requirements throughout the entire development supply chain. Recently, Sartorius’s management challenged the organization to achieve a higher quality in the products it produces for its customers, investing in a project to improve quality in design, purchasing, and electronic operations. Upon completion of the project, Sartorius Electronics contacted IPC Validation Services to become a certified company under the IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML).

 

Sartorius Electronics met or exceeded the requirements for the electronics industry's most rigorous classification, Class 3, intended for high-performance electronic assembly products. Sartorius Electronics is now one of the trusted sources of electronics suppliers and can be found on IPC's QML/QPL database at www.ipcvalidation.org.

 

Thomas Eckart, manager of electronic production, said, “As an international intercompany supplier to Sartorius AG, it is important that we have a valid standard for the manufacture and design of electronics within the company. An ISO9000 certification is not enough here because it doesn't look deeply into the technical processes.” Eckart continued, “An important point for us is also the strong involvement of our employees. Everyone stands by IPC and is very proud that we work at this level. It is important, especially in these times, with a severe shortage of skilled workers here in Europe, to motivate our employees and keep them in the company. The motivation provided by IPC Validation Services helps significantly here.”

 

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification. It also audits and certifies electronics companies' products and identifies processes that conform to IPC standards.

 

"Unlike other audit programs, IPC's Validation Services Programs uniquely provide technical and in-depth assessments of products and processes under IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize the QML for Sartorius Lab Instruments GmbH & Co. KG for becoming a member of IPC's network of trusted QML suppliers."

 

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org.

Statement from IPC on Recent U.S. Tariffs and Global Trade

IPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO: 

 

President Trump’s decision to postpone tariffs on goods covered by the United States-Mexico-Canada Agreement is the right move for building strength and resiliency in electronics. IPC urges the White House to work with the industry during the delay to protect the progress President Trump started during his first term to revitalize electronics manufacturing.

 

More than 10 percent of all trade with Canada and Mexico last year was in electronics, amounting to $184 billion. Both countries are major destinations for U.S. electronics exports with nearly one-third of all U.S. electronics exports headed to Canada or Mexico – roughly $80 billion in 2024. 

 

North America’s electronics industry is deeply interconnected, with components like printed circuit boards, semiconductors, and wiring harnesses crossing borders multiple times before final assembly. Nearly 78 percent of U.S. electronics imports from Mexico and 47 percent of exports occur within intra-firm trade. For Canada, intra-firm trade accounts for 50 percent of imports and 40 percent of exports, underscoring the seamless flow of critical components that sustain U.S. electronics manufacturing. Imposing these tariffs discourages investment, disrupts supply chains, and risks pushing manufacturers out of North America. 

 

Electronics are the backbone of innovation in AI, automotive, healthcare, and the national and economic security infrastructure. A strong domestic electronics industry is essential to maintaining U.S. leadership in many critical sectors. Tariffs on key trading partners and inputs like aluminum, steel, and copper will drive up costs, create uncertainty, and weaken a fragile U.S. electronics industry as other nations continue to invest and advance. IPC is eager to work with President Trump on his domestic pro-growth, pro-manufacturing agenda to build a stronger, more resilient industrial base.

IPC Hand Soldering Competition 2025 Regional Qualification - Italy

HSC Registration From
Date
- (2:00 - 10:00am CDT)

Join the Regional Qualification Italy for the IPC Hand Soldering Competition (HSC) at Vincenza Expo Centre, Italy 21-22 May 2025.

Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner and two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at productronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

The registration deadline is Thursday 15 May 2025.

You will receive a confirmation email specifying your date and time to compete.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

Vicenza Expo Centre

Vicenza Expo Centre – Pad. 1
Via Oreficeria, 16
36100 Vicenza VI
Italy

Vicenza Expo Centre

Vicenza Expo Centre
Vicenza Expo Centre – Pad. 1
Vicenza, VI 36100
Italy

HSC Registration From

IPC Hand Soldering Competition 2025 Regional Qualification - Budapest, Hungary

HSC Registration Form
Date
- (2:00 - 8:00am CDT)

Join the Regional Qualification Hungary for the IPC Hand Soldering Competition (HSC) at Innoelectro 2025, Budapest, Hungary on 8-10 April 2025.

Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner and two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at productronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year, again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

The registration deadline is Thursday 3 April 2025.

You will receive a confirmation email specifying your date and time to compete.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

InnoElectro Budapest, Hungary

Budapest
Dozsa Gyorgy ut 1
1146
Hungary

Event Venue Website
https://innoelectro.com/hu/

InnoElectro Budapest, Hungary

InnoElectro Budapest, Hungary
Dozsa Gyorgy ut 1
Budapest, 1146
Hungary

HSC Registration Form

IPC Strengthens Its Global Executive Leadership Team

Matt Kelly and David Bergman transition into new roles

In an effort to strengthen service to its more than 3,200 corporate global members, IPC announces the transition of two of its executive leadership staff into new IPC roles. Matt Kelly, who most recently served as IPC’s vice president of technology solutions, has assumed the role of vice president of standards & technology and remains chief technology officer (CTO). David Bergman, IPC’s longest tenured employee who served as IPC’s standards & technology vice president, has taken on the role of vice president of international relations. 

As CTO and vice president of standards & technology, Kelly will now lead both technology solutions and standards groups. Within the standards group, he will develop and implement strategic objectives strengthening IPC standards offerings. He will provide direction and leadership toward achieving the organization’s mission to ensure IPC standards remain at the forefront of the global electronics industry. In addition, Kelly and the technology solutions group will continue to strengthen the industry in the areas of advanced electronic packaging, next generation design, and digital manufacturing. By collaborating with industry, Kelly and the solutions group will provide industry leading thought leadership, develop new guidelines and standards, and recommend new education/training solutions. 

As vice president of international relations, Bergman is responsible for expanding and strengthening the organization's global presence, fostering international partnerships, and advocating for the electronics manufacturing industry. His key responsibilities include global expansion of strategic initiatives, market development and member engagement, event and conference representation and leadership and team development of IPC’s regional teams. Bergman will continue his term as World Electronics Circuits Council (WECC) secretary general as well as executive director of the Wiring Harness Manufacturer’s Association (WHMA).

“Matt is widely recognized in the global electronics industry as a premier thought leader and innovator. As CTO, he and his group helped define and achieve a portfolio of “factory of the future” standards and technical research; he has become a trusted advisor to governments for advanced packaging; driving a silicon to systems approach for the industry; and created and launched an Industry Chief Technologist Council that has produced numerous thought-leadership reports,” said John W. Mitchell IPC president and CEO. 

Mitchell continued, “Earlier in David’s IPC career, he held responsibilities for international relations and helped establish IPC operations in China, India, Malaysia and Europe. Now based in Southeast Asia, his vast experience in international business development, coupled with his expertise in strengthening IPC’s global presence makes sense for him to serve as international relations lead. This executive leadership transition further cements IPC’s role as the leading global electronics association.”

Kelly can be reached at MattKelly@ipc.org and Bergman can be reached at DavidBergman@ipc.org.

Best Technical Papers at IPC APEX EXPO 2025 Selected

Student scholarship also awarded by IPC Education Foundation

The best technical conference papers of IPC APEX EXPO 2025 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC), the international group of paper authors will be recognized during show opening remarks on Tuesday, March 18.

“The TPC is absolutely focused on providing the highest quality content to the technical conference,” said Stan Rak, co-chair of the TPC. “This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners and a thank you to all paper contributors in this 25th anniversary year of IPC APEX EXPO.”  

Taking top honors in the Best of Conference category, the winning papers are:

  • “High Voltage Temperature-humidity-bias Testing of Electronic Materials on the Outer Layer of a PCB – A Round Robin Study and Beyond” by Dr. Lothar Henneken, Robert Bosch GmbH. This paper will be presented during Technical Conference Session 1 on March 18.
  • “A Method for Real-Time Rejection of Defective Components During the Pick and Place Process Using AI Technology” by Dr. Eyal Weiss, Cybord. This paper will be presented during Technical Conference Session 3 on March 18.
  • “Alternative Methods in Measuring BGAs for Thermal Warpage” by Neil Hubble, Akrometrix. Co-author: Chris Gastaldo, Akrometrix. This paper will be presented during Technical Conference Session 5 on March 18.

The NextGen best paper is awarded to:

  • “Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions” by Ben Rachinger, Friedrich-Alexander-Universität Erlangen-Nürnberg. Co-authors: Nils Thielen, Sven Meier, Prof. Dr.-Ing. Jörg Franke, Prof. Dr.-Ing Florian Risch, Friedrich-Alexander-Universität Erlangen-Nürnberg, Institute for Factory Automation and Production Systems. This paper will be presented during Technical Conference Session 26 on March 19. 

The Best Student paper (and scholarship) is awarded to:

  • “Flexible Hybrid Electronics Created from a Multicomponent System of Electroless Copper on Laser-Induced Graphene”by Attila Rektor, Micron School of Materials Science and Engineering, Boise State University. Co-authors: Dr. Josh Eixenberger, Boise State University; Dr. Tony Vayalil Varghese, Boise State University; Brian Cummings, Boise State University; Michael Curtis, Boise State University, Science Applications International Corporation; Dr. Nicholas McKibben, Boise State University; Dr. John Timler, Science Applications International Corporation; and Prof. David Estrada, Boise State University, Idaho National Laboratory. This paper will be presented during Technical Conference Session 23 on March 19.

All technical conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry. 

To register for IPC APEX EXPO 2025 or for more information on all the activities taking place, including professional development courses, exhibition, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

Microvia Electroplating

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Tuesday and Thursday 5:00 – 7:00 p.m.

 

Description:

This course, led by industry expert Dr. Despina (DD) Davis, dives deep into the essential techniques and best practices for electroplating in high-density interconnects. Over four weeks, you'll explore the intricacies of plating quality, current calculations, copper kinetics, and pulse plating schemes. Gain hands-on experience with practical case studies and troubleshooting methods to enhance your skills and ensure the reliability of your microvias. Join us online and gain a thorough understanding of:

  • Calculating plating currents based on Faraday’s Equation.
  • Calculating Current Efficiency.
  • Designing pulse plating schemes for double-sided simultaneous plating.
  • Troubleshooting why recipes do not match theoretical values.
  • Improving copper plating uniformity alternatives.
  • Understanding effects of mass transport/diffusion on Microvia Plating → non-steady state process. 
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Certified Electronics Program Manager

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Date
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Tuesday and Thursday 5:00 – 7:00 p.m.

 

Description:

The IPC Certified Electronics Program Manager (CEPM) course is designed to ensure that your team has the tools and training they need to provide service that ensures clients for life. Taught by an IPC-certified industry expert with 30 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded training, job-specific exercises, and team projects to facilitate mastery of the key business and technical concepts required of program managers in the electronics industry.

Upon completion, participants will be able to:

  • Identify variations in company structure and program management within the electronics industry
  • Identify and address common challenges that impact customer relationships or program performance
  • Implement industry best practices and tools for:
  • Project planning
  • Project performance measurement
  • Continuous improvement
  • Explain the program manager’s role in account acquisition
  • Apply best practices in assessing project viability
  • Illustrate sales and negotiating skills
  • Assess areas of risk in the program launch
  • Apply best practices in ensuring efficient project management
  • Employ strategies for setting and managing expectations with customers and EMS companies
  • Create effective program reviews and account plans
  • Describe basic cost accounting practices and the role of the program manager in measuring and controlling project costs
  • Recognize the cost impact of excess inventory, late shipments, excess scrap due to poor design or vendor quality problems, and slow-paying customers
  • Explain the concepts associated with accurate forecasting and inventory control
  • Define basic contract terms and typical business risks associated with EMS projects o Apply best practices in negotiating these terms with customers
  • Describe manufacturing processes and common manufacturing issues that can impact project quality and on-time delivery
  • Identify the systems used in materials management within the EMS industry
  • Demonstrate best practices in sales and negotiation skills
  • Explain the principles behind building an effective team
  • Demonstrate how to deal with difficult people and motivate personnel in support organizations
  • Assess current competencies required in your segment of the EMS industry and develop a skills improvement plan
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Technical Overview of the Semiconductor Chip Industry

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Date
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Tuesday and Thursday 6:30 – 8:30 p.m.

 

Description:

From concept to creation, explore each stage of the semiconductor lifecycle — design, manufacturing, assembly, and testing.

Upon completing this immersive course, you will gain comprehensive insights into:

  • The fundamental components of microelectronics and how they power today's technology.
  • Key terms and cutting-edge technologies shaping the future of semiconductors.
  • The interconnected nature of the semiconductor supply chain and its impact on global markets.
  • The step-by-step journey of semiconductor chip development, from initial design to market delivery.
  • An overview of the critical manufacturing, assembly, and testing processes that ensure quality and performance.
  • Essential principles of failure analysis, enabling you to identify and resolve potential issues in chip functionality.
 
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